We help enable the connected car with dedicated automotive discrete, MOSFET and logic devices, all fully qualified to the AEC-Q100/Q101 standard. Along with traditional powertrain, chassis and body electronics our innovation supports new and future system designs, from wireless car safety all the way through to electric vehicle chargers. Our energy- and design-efficient products are backed up by dedicated manufacturing and supply chains to meet long-term volume needs.
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Featured packages |
Description |
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Clip-bonded FlatPower |
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Smallest automotive leadless logic solutions |
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Advanced power capability in a 2 mm x 2 mm footprint. |
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Leaflet (2) |
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| File name | Title | Type | Date |
| Nexperia_document_leaflet_ssMOSFET_automotive_201910_CHN | 符合AEC-Q101标准的MOSFET， 采用小型有引脚和无引脚DFN的 SMD封装 | Leaflet | 2019-10-23 |
| Nexperia_document_leaflet_ssMOSFET_automotive_201910 | AEC-Q101 qualified MOSFETs, SMD packages in both small leaded and leadless DFN | Leaflet | 2019-10-08 |
Marcom graphics (1) |
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| File name | Title | Type | Date |
| LFPAK56D_SOT1205_mk | plastic, single ended surface mounted package (LFPAK56D); 8 leads; 1.27 mm pitch; 4.7 mm x 5.3 mm x 1.05 mm body | Marcom graphics | 2017-01-28 |
Selection guide (2) |
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| File name | Title | Type | Date |
| Nexperia_Selection_guide_2020 | Nexperia Selection Guide 2020 | Selection guide | 2020-01-31 |
| nexperia_automotive_selection_guide_LR_201902 | Nexperia Automotive Selection Guide 2019 | Selection guide | 2019-02-18 |
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