We help enable the connected car with dedicated automotive discrete, MOSFET and logic devices, all fully qualified to the AEC-Q100/Q101 standard. Along with traditional powertrain, chassis and body electronics our innovation supports new and future system designs, from wireless car safety all the way through to electric vehicle chargers. Our energy- and design-efficient products are backed up by dedicated manufacturing and supply chains to meet long-term volume needs.
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Featured packages |
Description |
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Clip-bonded FlatPower |
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Smallest automotive leadless logic solutions |
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Advanced power capability in a 2 mm x 2 mm footprint. |
Featured products
Focus Packages
Latest news and blogs
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Leaflet (12) |
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| File name | Title | Type | Date |
| nexperia_document_leaflet_CCPAK_2020_CHN | CCPAK Power GaN FETs flyer | Leaflet | 2020-08-20 |
| nexperia_document_leaflet_GaN_CCPAK | CCPAK Power GaN FETs flyer | Leaflet | 2020-08-17 |
| nexperia_document_leaflet_LFPAK56_CHN_2020 | LFPAK56 车规级Power-SO8性能强劲 | Leaflet | 2020-05-01 |
| nexperia_document_leaflet_LFPAK56_LR_2020 | The automotive Power-SO8 that packs a punch | Leaflet | 2020-04-22 |
| Nexperia_Document_Leaflet_LFPAK33_12022020_CH | LFPAK33 leaflet | Leaflet | 2020-03-25 |
| Nexperia_document_leaflet_ssMOSFET_automotive_201910_CHN | 符合AEC-Q101标准的MOSFET， 采用小型有引脚和无引脚DFN的 SMD封装 | Leaflet | 2019-10-23 |
| Nexperia_document_leaflet_ssMOSFET_automotive_201910 | AEC-Q101 qualified MOSFETs, SMD packages in both small leaded and leadless DFN | Leaflet | 2019-10-08 |
| Nexperia_document_leaflet_DFN2020MD-6_CHN_2019 | DFN2020MD-6 带有可焊性侧面的无引脚封装 | Leaflet | 2019-09-27 |
| Nexperia_document_leaflet_DFN2020MD-6_2019 | DFN2020MD-6 Leadless package with side-wettable flanks | Leaflet | 2019-09-27 |
| Nexperia_document_leaflet_LFPAK88_A5_2019_CHN | 将功率密度提升到新高度 LFPAK88 | Leaflet | 2019-04-24 |
| Nexperia_document_LFPAK88_A5_leaflet_LR | Driving power-density to the next level with LFPAK88 | Leaflet | 2019-04-10 |
| nexperia_document_leaflet_LFPAK56D_factsheet_LR_201708 | LFPAK56D the ultimate dual MOSFET | Leaflet | 2017-08-17 |
Marcom graphics (7) |
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| File name | Title | Type | Date |
| LFPAK88_sot1235_mk | plastic, single-ended surface-mounted package (LFPAK88); 4 leads; 2 mm pitch; 8 mm x 8 mm x 1.6 mm body | Marcom graphics | 2019-04-10 |
| LFPAK56E-Combi | - | Marcom graphics | 2017-09-18 |
| LFPAK56D_SOT1205_mk | plastic, single ended surface mounted package (LFPAK56D); 8 leads; 1.27 mm pitch; 4.7 mm x 5.3 mm x 1.05 mm body | Marcom graphics | 2017-01-28 |
| LFPAK56D_SOT669_mk | plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| LFPAK56_SOT669_mk | plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| LFPAK33_SOT1210_mk | Plastic, single ended surface mounted package (LFPAK33); 8 leads; 0.65 mm pitch; 2.7 mm x 3.4 mm x 0.9 mm body | Marcom graphics | 2017-01-28 |
| DFN2020MD-6_SOT1220_mk | plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
Selection guide (3) |
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| File name | Title | Type | Date |
| Nexperia_Selection_guide_2021 | Nexperia Selection Guide 2021 | Selection guide | 2021-01-08 |
| Nexperia_Selection_guide_2020 | Nexperia Selection Guide 2020 | Selection guide | 2020-01-31 |
| nexperia_automotive_selection_guide_LR_201902 | Nexperia Automotive Selection Guide 2019 | Selection guide | 2019-02-18 |
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