PESDxL5UF; PESDxL5UV; PESDxL5UY
Parametrics
| Type number | Package name | Nr of lines | Configuration | VRWM (V) (V) | Cd [typ] (pF) | VESD IEC61000-4-2 (kV) |
|---|---|---|---|---|---|---|
| PESD3V3L5UF | XSON6 | 5 | Unidirectional | 3.3 | 22 | 20 |
| PESD3V3L5UY | TSSOP6 | 5 | Unidirectional | 3.3 | 22 | 20 |
| PESD5V0L5UF | XSON6 | 5 | Unidirectional | 5 | 16 | 20 |
| PESD5V0L5UY | TSSOP6 | 5 | Unidirectional | 5 | 16 | 20 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| PESD3V3L5UF | PESD3V3L5UF,115 (934061195115) |
Active | A1 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| PESD3V3L5UY | PESD3V3L5UY,115 (934057802115) |
Active | K3% |
TSSOP6 (SOT363) |
SOT363 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT363_115 |
| PESD5V0L5UF | PESD5V0L5UF,115 (934061199115) |
Active | A2 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| PESD5V0L5UY | PESD5V0L5UY,115 (934057803115) |
Active | K4% |
TSSOP6 (SOT363) |
SOT363 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT363_115 |
| PESD5V0L5UY,125 (934057803125) |
Active | K4% | SOT363_125 | ||||
| PESD5V0L5UYF (934057803135) |
Active | K4% | SOT363_135 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| PESD3V3L5UF | PESD3V3L5UF,115 | PESD3V3L5UF |
|
|
| PESD3V3L5UY | PESD3V3L5UY,115 | PESD3V3L5UY |
|
|
| PESD5V0L5UF | PESD5V0L5UF,115 | PESD5V0L5UF |
|
|
| PESD5V0L5UY | PESD5V0L5UY,115 | PESD5V0L5UY |
|
|
| PESD5V0L5UY | PESD5V0L5UY,125 | PESD5V0L5UY |
|
|
| PESD5V0L5UY | PESD5V0L5UYF | PESD5V0L5UY |
|
|
Documentation (17)
| File name | Title | Type | Date |
|---|---|---|---|
| PESDXL5UF_V_Y | Low capacitance unidirectional fivefold ESD protection diode arrays | Data sheet | 2020-05-01 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT363 | 3D model for products with SOT363 package | Design support | 2018-12-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| TSSOP6_SOT363_mk | plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT363 | plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body | Package information | 2022-06-01 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT363 | MAR_SOT363 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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