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Chemical content PESD5V0L5UF

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Type numberPackagePackage descriptionTotal product weight
PESD5V0L5UFdummy POV SOT886XSON61.98936 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934061199115912601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0152076.000000.76406
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0020910.470000.10526
Phenolic resinProprietary0.0027113.530000.13602
subTotal0.02000100.000001.00534
DieDoped siliconSilicon (Si)7440-21-30.06000100.000003.01605
subTotal0.06000100.000003.01605
Lead FrameCopper alloyCopper (Cu)7440-50-80.7325893.9200036.82471
Magnesium (Mg)7439-95-40.001560.200000.07842
Nickel (Ni)7440-02-00.024413.130001.22723
Silicon (Si)7440-21-30.005380.690000.27054
Pure metal layerGold (Au)7440-57-50.000230.030000.01176
Nickel (Ni)7440-02-00.014511.860000.72928
Palladium (Pd)7440-05-30.001330.170000.06665
subTotal0.78000100.0000039.20859
Mould CompoundFillerSilica -amorphous-7631-86-90.2484023.0000012.48643
Silica fused60676-86-00.6480060.0000032.57329
Flame retardantMetal hydroxideProprietary0.032403.000001.62866
ImpurityBismuth (Bi)7440-69-90.005400.500000.27144
PigmentCarbon black1333-86-40.005400.500000.27144
PolymerEpoxy resin systemProprietary0.075607.000003.80022
Phenolic resinProprietary0.064806.000003.25733
subTotal1.08000100.0000054.28881
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00007
Non hazardousProprietary0.000020.055500.00084
Tin solderTin (Sn)7440-31-50.0299899.940001.50712
subTotal0.03000100.000001.50803
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0193699.990000.97308
subTotal0.01936100.000000.97318
total1.98936100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.