LSF0108-Q100

8-bit bidirectional multi-voltage level translator; open-drain; push-pull

The LSF0108-Q100 is an 8 Channel bidirectional multi-voltage level translator for open-drain and push-pull applications. It supports up to 100 MHz up translation and ≥ 100 MHz down translation at ≤ 30 pF capacitive load. There is no need for a direction pin which minimizes system effort. The LSF0108-Q100 supports 5 V tolerant I/O pins for compatibility with TTL levels in a variety of applications. The ability to set up different voltage translation levels on each channel makes the device very flexible and suitable for a lot of different applications.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

Automotive product qualification in accordance with AEC-Q100 (Grade 1)
- Specified from -40 °C to +125 °C
Bidirectional voltage translation with no direction pin
Up translation
- ≤ 100 MHz; C_L = 30 pF
- ≤ 40 MHz; C_L = 50 pF
Down translation
- ≥ 100 MHz; C_L = 30 pF
- ≤ 40 MHz; C_L = 50 pF
Hot insertion
Bidirectional voltage level translation between:
- 0.95 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V
- 1.2 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V
- 1.8 V and 2.5 V, 3.3 V and 5.0 V
- 2.5 V and 3.3 V and 5.0 V
- 3.3 V and 5.0 V
Low standby current
5 V tolerant I/O pins to support TTL
Low R_ON provides less signal distortion
High-impedance I/O pins for EN = Low.
Flow-through pinout for easy PCB trace routing.
Latch-up performance exceeds 100 mA per JESD78 class II level A
ESD protection:
- HBM ANSI/ESDA/JEDEC JS-001 exceeds 2000 V
- CDM ANSI/ESDA/JEDEC JS-002 exceeds 1000 V
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

Applications

GPIO, MDIO, PMBus, SMBus, SDIO, UART, I²C, and other interfaces in Telecom infrastructure
Industrial
Personal computing
Automotive

Parametrics

Type number	Product status	V_CC(A) (V)	V_CC(B) (V)	Logic switching levels	Output drive capability (mA)	t_pd (ns)	No of bits	Power dissipation considerations	T_amb (°C)	Ψ_th(j-top) (K/W)	Package name
LSF0108BQ-Q100	Production	0.95 - 5.0	0.95 - 5.0	CMOS	n.a.	1.4	8	low	-40~125	0.0	DHVQFN20
LSF0108PW-Q100	Production	0.95 - 5.0	0.95 - 5.0	CMOS	n.a.	1.4	8	low	-40~125	0.0	TSSOP20

Package

Type number	Package	Package information	Reflow-/Wave soldering	Packing	Status	Marking	Orderable part number, (Ordering code (12NC))
LSF0108BQ-Q100	DHVQFN20 (SOT764-1)	SOT764-1		Reel 7” Q1/T1 or Q2/T3	Active	LSF0108	LSF0108BQ-Q100X ( 9356 909 19115 )
LSF0108PW-Q100	TSSOP20 (SOT360-1)	SOT360-1	SSOP-TSSOP-VSO-WAVE	Reel 13" Q1/T1	Active	LSF0108	LSF0108PW-Q100J ( 9356 909 18118 )

Quality, reliability & chemical content

Type number	Orderable part number	Chemical content	RoHS / RHF	Leadfree conversion date	EFR	IFR	MTBF (hour)	MSL	MSL leadfree
LSF0108BQ-Q100	LSF0108BQ-Q100X	LSF0108BQ-Q100			50.4	0.8	1.25E9	1	1
LSF0108PW-Q100	LSF0108PW-Q100J	LSF0108PW-Q100			50.4	0.8	1.25E9	1	1

Quality and reliability disclaimer

Documentation (5)

File name	Title	Type	Date
LSF0108_Q100	8-bit bidirectional multi-voltage level translator; open-drain; push-pull	Data sheet	2020-07-30
lsf0108	LSF0108 IBIS model	IBIS model	2020-04-14
SOT764-1	plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body	Package information	2021-08-17
SSOP-TSSOP-VSO-WAVE	Footprint for wave soldering	Wave soldering	2009-10-08
SOT360-1	plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body	Package information	2020-04-21

Support

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Models

File name	Title	Type	Date
lsf0108	LSF0108 IBIS model	IBIS model	2020-04-14

Ordering, pricing & availability

Sample

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