LSF0108-Q100
Parametrics
| Type number | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LSF0108BQ-Q100 | 0.95 - 5.0 | 0.95 - 5.0 | CMOS | + 64 | 1.4 | 8 | low | -40~125 | 77 | 8.7 | 49 | DHVQFN20 | Bi-directional | AutoSense |
| LSF0108PW-Q100 | 0.95 - 5.0 | 0.95 - 5.0 | CMOS | + 64 | 1.4 | 8 | low | -40~125 | 100 | 4.5 | 45 | TSSOP20 | Bi-directional | AutoSense |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| LSF0108BQ-Q100 | LSF0108BQ-Q100X (935690919115) |
Active | LSF0108 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| LSF0108PW-Q100 | LSF0108PW-Q100J (935690918118) |
Active | LSF0108 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| LSF0108BQ-Q100 | LSF0108BQ-Q100X | LSF0108BQ-Q100 |
|
|
| LSF0108PW-Q100 | LSF0108PW-Q100J | LSF0108PW-Q100 |
|
|
Documentation (12)
| File name | Title | Type | Date |
|---|---|---|---|
| LSF0108_Q100 | 8-bit bidirectional multi-voltage level translator; open-drain; push-pull | Data sheet | 2024-07-25 |
| AN90050 | Pin FMEA for LSF family | Application note | 2023-12-14 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| lsf0108 | LSF0108 IBIS model | IBIS model | 2020-04-14 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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Ordering, pricing & availability
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