Features and benefits
High power dissipation capability
- Suitable for Automatic Optical Inspection (AOI) of solder joint
- Smaller footprint compared to conventional leaded SMD packages
Low package height of 0.5 mm
General-purpose switching and amplification
Space restricted applications
|Type number||Package||Package information||Reflow-/Wave soldering||Packing||Status||Marking||Orderable part number, (Ordering code (12NC))|
( 9346 626 60147 )
( 9346 626 61147 )
|BC846XQB_SER||65 V, 100 mA NPN general-purpose transistor||Data sheet||2021-09-20|
|SOT8015||plastic, leadless extremely thin small outline package with side-wettable flanks (SWF); 3 terminals; 0.65 mm pitch; 1.1 mm x 1 mm x 0.48 mm body||Package information||2023-05-31|
|REFLOW_BG-BD-1||Reflow soldering profile||Reflow soldering||2021-04-06|
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