Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

PCMFxUSB3S

Common-mode EMI filter for differential channels with integrated ESD protection

Common-mode ElectroMagnetic Interference (EMI) filters with integrated ElectroStatic Discharge (ESD) protection for one, two and three differential channels. The devices are designed to provide low insertion loss for differential high-speed signals on each channel while unwanted common-mode signals are attenuated.

Each differential channel incorporates two signal lines that are coupled by integrated coils. Diodes provide protection to downstream components from ESD voltages up to ±15 kV on each signal line.

Table 1. Product overview

Type number

Number of channels

Package Name

PCMF1USB3S

1

WLCSP5

PCMF2USB3S

2

WLCSP10

PCMF3USB3S

3

WLCSP15

Features and benefits

  • One, two and three differential channels common-mode EMI filter with integrated ESD protection

  • Superior common-mode suppression over a wide frequency range

  • Extremely high symmetry between line pairs

  • ESD protection up to ±15 kV contact discharge according to IEC 61000-4-2

  • Superior RF performance compared to other integrated filters or discrete filters with external ESD protection

  • Industry-standard WLCSP5, 10 and 15 packages for smallest footprint

Applications

  • Smartphone, cellular and cordless phone

  • USB3.2, USB2.0, HDMI2.0, HDMI1.4

  • General-purpose EMI and Radio-Frequency Interference (RFI) filter and downstream ESD protection

  • Tablet PC and Mobile Internet Device (MID)

  • MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)

Parametrics

Type number Package version Package name Size (mm) Configuration Nr of lines VRWM (V) (V) Cd [typ] (pF) IPPM [max] (A) VESD (kV) (kV)
PCMF1USB3S WLCSP5_2-1-2 WLCSP5 0.77 x 1.17 x 0.57 Unidirectional 2 5 0.25 7 15
PCMF2USB3S WLCSP10_4-2-4 WLCSP10 1.57 x 1.17 x 0.57 Unidirectional 4 5 0.25 7 15
PCMF3USB3S WLCSP15_6-3-6 WLCSP15 2.37 x 1.17 x 0.57 Unidirectional 6 5 0.3 7 15

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
PCMF1USB3S PCMF1USB3S/CZ
(934071027087)		 Active WLCSP5_2-1-2
WLCSP5
(WLCSP5_2-1-2) 		WLCSP5_2-1-2 Not available
PCMF1USB3SZ
(934069594087)		 Active P "with circle" Not available
PCMF2USB3S PCMF2USB3S/CZ
(934071028087)		 Active WLCSP10_4-2-4
WLCSP10
(WLCSP10_4-2-4) 		WLCSP10_4-2-4 WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087
PCMF2USB3SZ
(934069591087)		 Active P with circle WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087
PCMF3USB3S PCMF3USB3S/CZ
(934071026087)		 Active WLCSP15_6-3-6
WLCSP15
(WLCSP15_6-3-6) 		WLCSP15_6-3-6 WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087
PCMF3USB3SZ
(934069589087)		 Active P with circle WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
PCMF1USB3S PCMF1USB3S/CZ PCMF1USB3S rohs rhf rhf
PCMF1USB3S PCMF1USB3SZ PCMF1USB3S rohs rhf rhf
PCMF2USB3S PCMF2USB3S/CZ PCMF2USB3S rohs rhf rhf
PCMF2USB3S PCMF2USB3SZ PCMF2USB3S rohs rhf rhf
PCMF3USB3S PCMF3USB3S/CZ PCMF3USB3S rohs rhf rhf
PCMF3USB3S PCMF3USB3SZ PCMF3USB3S rohs rhf rhf
Quality and reliability disclaimer

Documentation (10)

File name Title Type Date
PCMFXUSB3S_SER Common-mode EMI filter for differential channels with integrated ESD protection Data sheet 2019-03-07
WLCSP5_2-1-2 3D model for products with WLCSP5_2-1-2 package Design support 2023-03-13
WLCSP10_4-2-4 3D model for products with WLCSP10_4-2-4 package Design support 2023-03-13
WLCSP15_6-3-6 3D model for products with WLCSP15_6-3-6 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
WLCSP5_2-1-2_mk wafer level chip-size package; 5 bumps (2-1-2) Marcom graphics 2017-01-28
WLCSP10_4-2-4_mk wafer level chip-size package; 10 bumps (4-2-4) Marcom graphics 2017-01-28
WLCSP5_2-1-2 wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body Package information 2020-04-21
WLCSP10_4-2-4 wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body Package information 2020-04-21
WLCSP15_6-3-6 wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body Package information 2020-04-21

Support

If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.

Models

File name Title Type Date
WLCSP5_2-1-2 3D model for products with WLCSP5_2-1-2 package Design support 2023-03-13
WLCSP10_4-2-4 3D model for products with WLCSP10_4-2-4 package Design support 2023-03-13
WLCSP15_6-3-6 3D model for products with WLCSP15_6-3-6 package Design support 2023-03-13

Ordering, pricing & availability

Sample

As a Nexperia customer you can order samples via our sales organization.

If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.