PESDxUSB3B

ESD protection for differential data lines

ElectroStatic Discharge (ESD) protection for one, two and three differential channels.

The devices are footprint compatible to PCMFxUSB3B/C common mode filters with ESD protection.

Diodes provide protection to downstream components from ESD voltages up to ±20 kV on each signal line.

Table 1. Product overview
Type Number	Number of channels	Package name
PESD1USB3B/C	1	WLCSP5
PESD2USB3B/C	2	WLCSP10
PESD3USB3B/C	3	WLCSP15

Features and benefits

Allows switching between PCMFxUSB3B/C common mode filters with ESD protection and PESDxUSB3B/C ESD protection in the same footprint
TrEOS protection process for very high system-level ESD robustness: superior protection of sensitive Systems on Chips (SoCs)
ESD protection for one, two and three differential channels up to ±20 kV contact discharge according to IEC 61000-4-2
Industry-standard WLCSP5, 10 and 15 packages for smallest footprint
Bidirectional for audio line option

Applications

Smartphone, cellular and cordless phone
USB3.2, USB2.0, HDMI2.0, HDMI1.4
General-purpose downstream ESD protection for differential data lines
Tablet PC and Mobile Internet Device (MID)
MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)

Parametrics

Type number	Package version	Package name	Size (mm)	Configuration	Nr of lines	V_RWM (V)	C_d [typ] (pF)	I_PPM [max] (A)	V_ESD (kV)	Product status
PESD1USB3B	WLCSP5_2-1-2	WLCSP5	0.77 x 1.17 x 0.57	Bidirectional	2	4	0.29	9.5	20	Production
PESD2USB3B	WLCSP10_4-2-4	WLCSP10	1.57 x 1.17 x 0.57	Bidirectional	4	4	0.29	9.5	20	Production
PESD3USB3B	WLCSP15_6-3-6	WLCSP15	2.37 x 1.17 x 0.57	Bidirectional	6	4	0.29	9.5	20	Production

Package

Type number	Package	Package information	Packing	Status	Marking	Orderable part number, (Ordering code (12NC))
PESD1USB3B/C	WLCSP5 (WLCSP5_2-1-2)	WLCSP5_2-1-2	WLCSP5_2-1-2_087	Active	Standard Marking	PESD1USB3B/CZ ( 9346 602 93087 )
PESD2USB3B/C	WLCSP10 (WLCSP10_4-2-4)	WLCSP10_4-2-4	WLCSP10_4-2-4_087	Active	Standard Marking	PESD2USB3B/CZ ( 9346 602 94087 )
PESD3USB3B/C	WLCSP15 (WLCSP15_6-3-6)	WLCSP15_6-3-6	WLCSP15_6-3-6_087	Active	Standard Marking	PESD3USB3B/CZ ( 9346 602 95087 )

The variants in the table below are discontinued. See the table Discontinuation information for more information.

Type number	Package	Package information	Reflow-/Wave soldering	Packing	Status	Marking	Orderable part number, (Ordering code (12NC))
PESD1USB3B/C	WLCSP5 (WLCSP5_2-1-2)	WLCSP5_2-1-2		WLCSP5_2-1-2_115	Withdrawn / End-of-life	Standard Marking	PESD1USB3B/CX ( 9346 602 93115 )
PESD2USB3B/C	WLCSP10 (WLCSP10_4-2-4)	WLCSP10_4-2-4		WLCSP10_4-2-4_115	Withdrawn / End-of-life	Standard Marking	PESD2USB3B/CX ( 9346 602 94115 )

Discontinuation information

Type number	Orderable part number, (Ordering code (12NC))	Last time buy date	Last time delivery date	Replacement product	Status	Comments
PESD1USB3B/C	934660293115
PESD2USB3B/C	934660294115
PESD3USB3B/C	934660295115

Environmental information

Type number	Orderable part number	Chemical content
PESD1USB3B/C	PESD1USB3B/CZ	Not available You can request this via a support request
PESD2USB3B/C	PESD2USB3B/CZ	Not available You can request this via a support request
PESD3USB3B/C	PESD3USB3B/CZ	Not available You can request this via a support request

The variants in the table below are discontinued. See the table Discontinuation information for more information.

Type number	Orderable part number	Chemical content	RoHS	RHF-indicator	Leadfree conversion date
PESD1USB3B/C	PESD1USB3B/CX	Not available You can request this via a support request			week 25, 2019
PESD2USB3B/C	PESD2USB3B/CX	Not available You can request this via a support request			week 25, 2019

Quality and reliability disclaimer

Documentation (4)

File name	Title	Type	Date
PESDXUSB3B_C_SER	ESD protection for differential data lines	Data sheet	2019-01-29
WLCSP5_2-1-2	wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body	Package information	2020-04-21
WLCSP15_6-3-6	wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body	Package information	2020-04-21
WLCSP10_4-2-4	wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body	Package information	2020-04-21

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