Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Automotive ASFETs for half-bridge configurations

60% lower parasitic inductance and improved thermal performance

A series of half-bridge (high side & low side) MOSFETs constructed in the space-saving LFPAK56D package format. The half-bridge configurationis a standard building block for many automotive applications including motor drives and DC/DC converters. The LFPAK56D half-bridge occupies 30% lower PCB area compared to dual MOSFETs due to the removal of PCB tracks whilst also permitting simple automated optical inspection (AOI) during production. Utilising existing high volume LFPAK56D assembly processes, with proven automotive reliability. The package format uses flexible leads to improve overall reliability, as well as an internal copper clip connection between the MOSFETs simplifying PCB design, offering a plug and play style solution with exceptional current handling capability to your application.

Features and Benefits

  • 60% lower parasitic inductance due to internal clip connection
  • 30% space saving on PCB compared to LFPAK56D dual
  • High performance ID max >60 A
  • Low thermal resistance
  • Flexible leads for BLR
  • Footprint compatible with LFPAK56D dual
  • External leads for easy AOI
  • Beyond AEC-Q101 for automotive products

Applications

  • 3-phase automotive power train applications
    • Fuel, oil and water pumps
  • Motor control
  • DC/DC

Parametric search

Automotive ASFETs for half-bridge configurations
Please wait loading data...
Parametric search is unavailable.

Products

Type number Description Status Quick access
BUK7V4R2-40H Dual N-channel 40 V, 4.2 mOhm standard level MOSFET in LFPAK56D (half-bridge configuration) Production
BUK9V13-40H Dual N-channel 40 V, 13 mOhm logic level MOSFET in LFPAK56D (half-bridge configuration) Production
Visit our documentation center for all documentation

Application note (2)

File name Title Type Date
AN90003.pdf LFPAK MOSFET thermal design guide Application note 2023-08-22
AN90011.pdf Half-bridge MOSFET switching and its impact on EMC Application note 2020-04-28

Marcom graphics (1)

File name Title Type Date
RS3408.jpg Automotive water pump MARCOM image Marcom graphics 2021-11-25

Selection guide (1)

File name Title Type Date
Nexperia_Selection_guide_2023.pdf Nexperia Selection Guide 2023 Selection guide 2023-05-10

SPICE model (2)

File name Title Type Date
BUK9V13-40H.lib BUK9V13-40H SPICE model SPICE model 2021-02-09
BUK7V4R2-40H.lib BUK7V4R2-40H SPICE model SPICE model 2021-02-09

Thermal model (4)

File name Title Type Date
BUK9V13-40H_Foster.lib BUK9V13-40H Foster thermal model Thermal model 2021-02-09
BUK9V13-40H_Cauer.lib BUK9V13-40H Cauer thermal model Thermal model 2021-02-09
BUK7V4R2-40H_Foster.lib BUK7V4R2-40H Foster thermal model Thermal model 2021-02-09
BUK7V4R2-40H_Cauer.lib BUK7V4R2-40H Cauer thermal model Thermal model 2021-02-09

If you have a support question, let us know. If you are in need of design support, let us know and fill in the answer form, well get back to you shortly.

Or contact us for further support.


Cross reference