NEVB-LOGIC01 - DIL footprint (TSSOP / DHVQFN / XQFN) adapter board
NEVB-LOGIC01 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
NEVB-LOGIC01 footprint adapter board
Key features & benefits
Plug and play: identify the package you will be using, place the device in the footprint and solder the device down to start evaluating
Packages on the board (8)
| Package | Package name | Package information | Package description | Reference | Date |
|---|---|---|---|---|---|
TSSOP20 (SOT360-1) |
TSSOP20 | SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2003-02-07 |
TSSOP24 (SOT355-1) |
TSSOP24 | SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2024-11-07 |
TSSOP14 (SOT402-1) |
TSSOP14 | SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2023-10-27 |
TSSOP16 (SOT403-1) |
TSSOP16 | SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2023-10-27 |
DHVQFN16 (SOT763-1) |
DHVQFN16 | SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | MO-241 (JEDEC) | 2003-01-27 |
DHVQFN20 (SOT764-1) |
DHVQFN20 | SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | MO-241 (JEDEC) | 2014-12-12 |
DHVQFN24 (SOT815-1) |
DHVQFN24 | SOT815-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 5.5 mm x 3.5 mm x 1 mm body | 2003-04-29 | |
XQFN12 (SOT1174-1) |
XQFN12 | SOT1174-1 | plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm body | MO-288 (JEDEC) | 2010-04-21 |
Related boards (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
NEVB-LOGIC02---DIL-footprint--XSON---X2SON---TSSOP---VSSOP--adapter-board | NEVB-LOGIC02 - DIL footprint (XSON / X2SON / TSSOP / VSSOP) adapter board | Evaluation board | Order | |
|
NEVB-LOGIC03---DIL-footprint--WLCSP--adapter-board | NEVB-LOGIC03 - DIL footprint (WLCSP) adapter board | Evaluation board | Order | |
|
NEVB-LOGIC04---DIL-footprint--XSON---DHXQFN-----adapter-board | NEVB-LOGIC04 - DIL footprint (XSON / DHXQFN) adapter board | Evaluation board | Order |
Packages on the board (8)
| Package | Package name | Package information | Package description | Reference | Date |
|---|---|---|---|---|---|
|
TSSOP20 (SOT360-1) |
TSSOP20 | SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2003-02-07 |
|
TSSOP24 (SOT355-1) |
TSSOP24 | SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2024-11-07 |
|
TSSOP14 (SOT402-1) |
TSSOP14 | SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2023-10-27 |
|
TSSOP16 (SOT403-1) |
TSSOP16 | SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2023-10-27 |
|
DHVQFN16 (SOT763-1) |
DHVQFN16 | SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | MO-241 (JEDEC) | 2003-01-27 |
|
DHVQFN20 (SOT764-1) |
DHVQFN20 | SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | MO-241 (JEDEC) | 2014-12-12 |
|
DHVQFN24 (SOT815-1) |
DHVQFN24 | SOT815-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 5.5 mm x 3.5 mm x 1 mm body | 2003-04-29 | |
|
XQFN12 (SOT1174-1) |
XQFN12 | SOT1174-1 | plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm body | MO-288 (JEDEC) | 2010-04-21 |
Related boards (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
|
NEVB-LOGIC02---DIL-footprint--XSON---X2SON---TSSOP---VSSOP--adapter-board | NEVB-LOGIC02 - DIL footprint (XSON / X2SON / TSSOP / VSSOP) adapter board | Evaluation board | Order | |
|
|
NEVB-LOGIC03---DIL-footprint--WLCSP--adapter-board | NEVB-LOGIC03 - DIL footprint (WLCSP) adapter board | Evaluation board | Order | |
|
|
NEVB-LOGIC04---DIL-footprint--XSON---DHXQFN-----adapter-board | NEVB-LOGIC04 - DIL footprint (XSON / DHXQFN) adapter board | Evaluation board | Order |
Documentation (1)
| File name | Title | Type | Date |
|---|---|---|---|
| nexperia_factsheet_dual_in_line_logic_footprint_adapter_boards | Dual in-line Logic footprint adapter boards | Leaflet | 2026-06-04 |
Support
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