Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC power devices

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

3-phase front-end power supply unit (PSU)

In modern AI and hyperscale datacenters, front‑end power supplies (PSUs) form the backbone of high‑density power delivery. Optimized for efficiency, fast load transients and scalable parallel operation, they convert utility power into stable DC rails while operating reliably under continuous high thermal stress. Designed to work seamlessly with downstream converters and battery backup units (BBUs), advanced front‑end PSUs ensure uninterrupted performance across demanding compute workloads. AI‑focused PSUs are required to support multi‑kilowatt power levels (typically 3-12 kW per unit) while maintaining peak efficiency. At the rack level, this translates to power levels spanning approximately 15-250 kW and rising, reflecting the increasing demands of modern AI infrastructure.

  • Block diagram
  • Design considerations
  • Design resources
  • Product listing
  • Support

Block diagram

AC / DCconversion(PFC) DC / DCconversion Gate driver Aux power supply Signalprocessing Commsinterdace Power distribution unit (PDU) CPU aaa-045734 PFC (bridge / bridgeless)in DC SMPS grid Highlighted components are Nexperia focus products.

Communication Interface

Power Distribution unit (PDU)​

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To view more information about the Nexperia components used in this application, please select a component above or click on a component (highlighted in blue) in the block diagram.

Design considerations

  • Transitioning to GaN FETs and SiC MOSFETs is critical for minimizing switching and conduction losses. Nexperia cascode GaN FETs are specifically suited for high-voltage 650 V applications like the PFC stage. Integrated damping of the series also helps with EMC performance.
  • On the Synchronous Rectification secondary side, replacing traditional diodes with low RDS(on) MOSFETs, such as the NextPowerS3 series, significantly boosts total system efficiency
  • Nexperia LFPAK (copper clip) technology is essential for reducing parasitic inductance and improving thermal resistance compared to standard wire-bonded packages.
  • AI hardware is highly sensitive to power transients and noise. External ESD protection is necessary as silicon geometries shrink and become more vulnerable. Low-capacitance diodes are required for high-speed data interfaces within the PSU management system.
  • Implementing eFuses, ideal diodes and load switches ensures resilience against short-circuits, inrush currents and reverse polarity, which is vital for maintaining "six nines" uptime in datacenters