Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AHCT02BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHCT02BQ-Q100SOT762-1DHVQFN1418.258111 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353009821155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0002331.0000000.001274
FillerSilver (Ag)7440-22-40.01744575.0000000.095547
PolymerAcrylic resinProprietary0.0013966.0000000.007644
Resin systemProprietary0.00418718.0000000.022931
subTotal0.023260100.0000000.127395
DieDoped siliconSilicon (Si)7440-21-30.284493100.0000001.558173
subTotal0.284493100.0000001.558173
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.74471097.47000036.940895
Iron (Fe)7439-89-60.1660752.4000000.909594
Phosphorus (P)7723-14-00.0020760.0300000.011370
Zinc (Zn)7440-66-60.0069200.1000000.037900
subTotal6.919780100.00000037.899759
Mould CompoundAdditiveNon hazardousProprietary0.3139172.9840001.719330
FillerSilica -amorphous-7631-86-90.3671483.4900002.010878
Silica fused60676-86-08.92307284.82000048.871827
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1054111.0020000.577335
PigmentCarbon black1333-86-40.0172530.1640000.094494
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.3893463.7010002.132453
Epoxy resin systemProprietary0.1668471.5860000.913826
Phenolic resinProprietary0.2370162.2530001.298140
subTotal10.520010100.00000057.618283
Pre-PlatingPure metal layerGold (Au)7440-57-50.0138423.0000000.075813
Nickel (Ni)7440-02-00.42587292.3000002.332510
Palladium (Pd)7440-05-30.0143033.1000000.078340
Silver (Ag)7440-22-40.0073821.6000000.040434
subTotal0.461400100.0000002.527096
WirePure metalCopper (Cu)7440-50-80.04747296.5500000.260003
Pure metal layerGold (Au)7440-57-50.0001720.3500000.000943
Palladium (Pd)7440-05-30.0015243.1000000.008348
subTotal0.049168100.0000000.269294
total18.258111100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.