Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AHCT240BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHCT240BQSOT764-1DHVQFN2028.028440 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528262711510126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0008531.0000000.003043
FillerSilver (Ag)7440-22-40.06396075.0000000.228197
PolymerAcrylic resinProprietary0.0051176.0000000.018256
Resin systemProprietary0.01535018.0000000.054767
subTotal0.085280100.0000000.304262
DieDoped siliconSilicon (Si)7440-21-30.341881100.0000001.219764
subTotal0.341881100.0000001.219764
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.58916097.47000037.780056
Iron (Fe)7439-89-60.2607362.4000000.930257
Phosphorus (P)7723-14-00.0032590.0300000.011628
Zinc (Zn)7440-66-60.0108640.1000000.038761
subTotal10.864020100.00000038.760702
Mould CompoundAdditiveNon hazardousProprietary0.4886272.9840001.743327
FillerSilica -amorphous-7631-86-90.5714843.4900002.038945
Silica fused60676-86-013.88919984.82000049.553948
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1640771.0020000.585393
PigmentCarbon black1333-86-40.0268550.1640000.095813
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6060353.7010002.162216
Epoxy resin systemProprietary0.2597061.5860000.926581
Phenolic resinProprietary0.3689272.2530001.316258
subTotal16.374910100.00000058.422481
Pre-PlatingPure metal layerGold (Au)7440-57-50.0027581.0000000.009839
Nickel (Ni)7440-02-00.25095191.0000000.895343
Palladium (Pd)7440-05-30.0220628.0000000.078711
subTotal0.275770100.0000000.983894
WirePure metalCopper (Cu)7440-50-80.08359296.5500000.298239
Pure metal layerGold (Au)7440-57-50.0003030.3500000.001081
Palladium (Pd)7440-05-30.0026843.1000000.009576
subTotal0.086579100.0000000.308896
total28.028440100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.