Chemical content 74AHCT2G32DP-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT2G32DP-Q100SOT505-2TSSOP821.06220 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301452125412601235Ayutthaya, Thailand; Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0198280.100000.09409
PolymerResin systemProprietary0.0049219.900000.02337
DieDoped siliconSilicon (Si)7440-21-30.12590100.000000.59776
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.5093097.4700040.40080
Iron (Fe)7439-89-60.209522.400000.99479
Phosphorus (P)7723-14-00.002620.030000.01243
Zinc (Zn)7440-66-60.008730.100000.04145
Mould CompoundFillerSilica -amorphous-7631-86-90.072150.600000.34256
Silica fused60676-86-09.4193478.3300044.72154
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.733546.100003.48272
PigmentCarbon black1333-86-40.024050.200000.11419
PolymerEpoxy resin systemProprietary1.065678.862005.05965
Phenolic resinProprietary0.710455.908003.37310
Pre-PlatingPure metal layerGold (Au)7440-57-50.003603.000000.01707
Nickel (Ni)7440-02-00.1106292.300000.52521
Palladium (Pd)7440-05-30.003723.100000.01764
Silver (Ag)7440-22-40.001921.600000.00910
WirePure metalCopper (Cu)7440-50-80.03634100.000000.17255
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.