Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AXP1T125GM

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AXP1T125GMSOT886XSON61.936193 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93530698512510126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.071298100.0000003.682381
subTotal0.071298100.0000003.682381
ComponentAdditiveNon hazardousProprietary0.0002505.0000000.012912
FillerBisphenol A-epichlorohydrin resin25068-38-60.0002505.0000000.012912
Silica -amorphous-7631-86-90.00250050.0000000.129119
PolymerEpoxy resin systemProprietary0.00150030.0000000.077472
Phenol Formaldehyde resin (generic)9003-35-40.00050010.0000000.025824
subTotal0.005000100.0000000.258239
Lead FrameCopper alloyCopper (Cu)7440-50-80.72961794.51000037.683082
Magnesium (Mg)7439-95-40.0011580.1500000.059808
Nickel (Ni)7440-02-00.0227742.9500001.176226
Silicon (Si)7440-21-30.0049410.6400000.255181
Pure metal layerGold (Au)7440-57-50.0001540.0200000.007974
Nickel (Ni)7440-02-00.0126611.6400000.653902
Palladium (Pd)7440-05-30.0006950.0900000.035885
subTotal0.772000100.00000039.872058
Mould CompoundAdditiveNon hazardousProprietary0.0043710.4100000.225732
FillerSilica -amorphous-7631-86-90.0030910.2900000.159664
Silica fused60676-86-00.91835986.15000047.431170
HardenerPhenolic resinProprietary0.0457314.2900002.361924
PigmentCarbon black1333-86-40.0020250.1900000.104607
PolymerEpoxy resin systemProprietary0.0924228.6700004.773398
subTotal1.066000100.00000055.056495
WireGold alloyGold (Au)7440-57-50.02167699.0000001.119519
Palladium (Pd)7440-05-30.0002191.0000000.011308
subTotal0.021895100.0000001.130827
total1.936193100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.