Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAS116LS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAS116LSSOD882BDDFN1006-20.880538 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663992315212601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01444076.0000001.639907
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00198910.4700000.225919
Phenolic resinProprietary0.00257113.5300000.291947
subTotal0.019000100.0000002.157772
DieDoped siliconSilicon (Si)7440-21-30.020000100.0000002.271339
subTotal0.020000100.0000002.271339
Lead FrameCopper alloyCopper (Cu)7440-50-80.37762095.60000042.885145
Magnesium (Mg)7439-95-40.0005920.1500000.067288
Nickel (Ni)7440-02-00.0117712.9800001.336796
Silicon (Si)7440-21-30.0025680.6500000.291583
Pure metal layerGold (Au)7440-57-50.0000400.0100000.004486
Nickel (Ni)7440-02-00.0022520.5700000.255696
Palladium (Pd)7440-05-30.0001580.0400000.017944
subTotal0.395000100.00000044.858939
Mould CompoundFillerSilica -amorphous-7631-86-90.0337557.9800003.833497
Silica fused60676-86-00.33878980.09200038.475246
PigmentCarbon black1333-86-40.0039250.9280000.445800
PolymerEpoxy resin systemProprietary0.0357448.4500004.059280
Phenolic resinProprietary0.0107862.5500001.224990
subTotal0.423000100.00000048.038813
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000102
Non hazardousProprietary0.0000110.0555000.001261
Tin solderTin (Sn)7440-31-50.01998899.9400002.269976
subTotal0.020000100.0000002.271339
WireImpurityNon hazardousProprietary0.0000000.0100000.000040
Pure metalGold (Au)7440-57-50.00353899.9900000.401760
subTotal0.003538100.0000000.401800
total0.880538100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.