Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content MMBD4148

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
MMBD4148SOT23TO-236AB7.646390 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934063957215712601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000000.392342
subTotal0.030000100.0000000.392342
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0022940.0900000.030002
Carbon (C)7440-44-00.0010200.0400000.013334
Chromium (Cr)7440-47-30.0056080.2200000.073339
Cobalt (Co)7440-48-40.0109610.4300000.143345
Iron (Fe)7439-89-61.22301047.98000015.994609
Manganese (Mn)7439-96-50.0219210.8600000.286690
Nickel (Ni)7440-02-00.92120936.14000012.047628
Phosphorus (P)7723-14-00.0005100.0200000.006667
Silicon (Si)7440-21-30.0066270.2600000.086674
Sulphur (S)7704-34-90.0005100.0200000.006667
Pure metal layerCopper (Cu)7440-50-80.28982111.3700003.790302
Silver (Ag)7440-22-40.0655092.5700000.856735
subTotal2.549000100.00000033.335993
Mould CompoundAdditiveNon hazardousProprietary0.1414912.9000001.850429
Triphenylphosphine603-35-00.0024400.0500000.031904
FillerSilica -amorphous-7631-86-93.51288072.00000045.941680
PigmentCarbon black1333-86-40.0024400.0500000.031904
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.73185015.0000009.571183
Phenol Formaldehyde resin (generic)9003-35-40.48790010.0000006.380789
subTotal4.879000100.00000063.807888
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000109
Non hazardousProprietary0.0001030.0555000.001343
Tin solderTin (Sn)7440-31-50.18488999.9400002.417991
subTotal0.185000100.0000002.419442
WirePure metalCopper (Cu)7440-50-80.003390100.0000000.044331
subTotal0.003390100.0000000.044331
total7.646390100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.