Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD24VS2UT

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD24VS2UTSOT23TO-236AB7.867230 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405761221515126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.140000100.0000001.779534
subTotal0.140000100.0000001.779534
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0023520.0800000.029896
Carbon (C)7440-44-00.0011760.0400000.014948
Chromium (Cr)7440-47-30.0061740.2100000.078477
Cobalt (Co)7440-48-40.0123480.4200000.156955
Iron (Fe)7439-89-61.38180047.00000017.563996
Manganese (Mn)7439-96-50.0246960.8400000.313910
Nickel (Ni)7440-02-01.04105435.41000013.232790
Phosphorus (P)7723-14-00.0005880.0200000.007474
Silicon (Si)7440-21-30.0073500.2500000.093426
Sulphur (S)7704-34-90.0005880.0200000.007474
Pure metal layerCopper (Cu)7440-50-80.38220013.0000004.858127
Silver (Ag)7440-22-40.0796742.7100001.012733
subTotal2.940000100.00000037.370205
Mould CompoundAdditiveNon hazardousProprietary0.1324722.9000001.683846
Triphenylphosphine603-35-00.0022840.0500000.029032
FillerSilica -amorphous-7631-86-93.28896072.00000041.805820
PigmentCarbon black1333-86-40.0022840.0500000.029032
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.68520015.0000008.709546
Phenol Formaldehyde resin (generic)9003-35-40.45680010.0000005.806364
subTotal4.568000100.00000058.063639
Post-PlatingImpurityLead (Pb)7439-92-10.0000090.0045000.000109
Non hazardousProprietary0.0001050.0555000.001340
Tin solderTin (Sn)7440-31-50.18988699.9400002.413632
subTotal0.190000100.0000002.415081
WireImpurityNon hazardousProprietary0.0000030.0100000.000037
Pure metalCopper (Cu)7440-50-80.02922299.9900000.371440
subTotal0.029225100.0000000.371478
total7.867230100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.