Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMXB350UPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMXB350UPESOT1215DFN1010D-31.170575 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340671521475126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.02400080.0000002.050274
PolymerAcrylic resinProprietary0.00600020.0000000.512569
subTotal0.030000100.0000002.562843
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000004.271405
subTotal0.050000100.0000004.271405
Lead FrameCopper alloyChromium (Cr)7440-47-30.0012720.2400000.108665
Copper (Cu)7440-50-80.50090394.51000042.791192
Tin (Sn)7440-31-50.0012720.2400000.108665
Zinc (Zn)7440-66-60.0011130.2100000.095081
Pure metal layerGold (Au)7440-57-50.0003710.0700000.031694
Nickel (Ni)7440-02-00.0229494.3300001.960490
Palladium (Pd)7440-05-30.0021200.4000000.181108
subTotal0.530000100.00000045.276894
Mould CompoundFillerSilica -amorphous-7631-86-90.11730023.00000010.020716
Silica fused60676-86-00.30600060.00000026.140999
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0153003.0000001.307050
Ion trapping agentBismuth (Bi)7440-69-90.0025500.5000000.217842
PigmentCarbon black1333-86-40.0025500.5000000.217842
PolymerEpoxy resin systemProprietary0.0357007.0000003.049783
Phenolic resinProprietary0.0306006.0000002.614100
subTotal0.510000100.00000043.568332
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000115
Non hazardousProprietary0.0000170.0555000.001422
Tin solderTin (Sn)7440-31-50.02998299.9400002.561305
subTotal0.030000100.0000002.562843
WireImpurityNon hazardousProprietary0.0000020.0100000.000176
Pure metalGold (Au)7440-57-50.02057399.9900001.757533
subTotal0.020575100.0000001.757709
total1.170575100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.