Features and benefits
- Wide supply voltage range from 0.8 V to 3.6 V
- High noise immunity
- Complies with JEDEC standards:
- JESD8-12 (0.8 V to 1.3 V)
- JESD8-11 (0.9 V to 1.65 V)
- JESD8-7 (1.2 V to 1.95 V)
- JESD8-5 (1.8 V to 2.7 V)
- JESD8-B (2.7 V to 3.6 V)
- ESD protection:
- HBM JESD22-A114F Class 3A exceeds 5000 V
- MM JESD22-A115-A exceeds 200 V
- CDM JESD22-C101E exceeds 1000 V
- Low static power consumption; ICC = 0.9 μA (maximum)
- Latch-up performance exceeds 100 mA per JESD 78 Class II
- Inputs accept voltages up to 3.6 V
- Low noise overshoot and undershoot < 10 % of VCC
- IOFF circuitry provides partial Power-down mode operation
- Multiple package options
- Specified from -40 °C to +85 °C and -40 °C to +125 °C
Parametrics
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74AUP2G157DC | Production | 0.8 - 3.6 | CMOS | 1.9 / -1.9 | 3.4 | ultra low | -40~125 | 203 | 34.1 | 113 | VSSOP8 |
74AUP2G157GN | Production | 0.8 - 3.6 | CMOS | 1.9 / -1.9 | 3.4 | ultra low | -40~125 | 238 | 10.6 | 148 | XSON8 |
74AUP2G157GS | Production | 0.8 - 3.6 | CMOS | 1.9 / -1.9 | 3.4 | ultra low | -40~125 | 276 | 10.8 | 146 | XSON8 |
74AUP2G157GT | Production | 0.8 - 3.6 | CMOS | 1.9 / -1.9 | 3.4 | ultra low | -40~125 | 327 | 6.1 | 157 | XSON8 |
Package
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
---|---|---|---|---|---|---|---|
74AUP2G157DC | ![]() VSSOP8 (SOT765-1) | SOT765-1 | Reel 7" Q3/T4, Reverse | Active | a2P | 74AUP2G157DC,125 ( 9352 807 34125 ) | |
74AUP2G157GN | ![]() XSON8 (SOT1116) | SOT1116 | REFLOW_BG-BD-1 | Reel 7” Q1/T1 or Q2/T3 | Active | aP | 74AUP2G157GN,115 ( 9352 922 23115 ) |
74AUP2G157GS | ![]() XSON8 (SOT1203) | SOT1203 | REFLOW_BG-BD-1 | Reel 7” Q1/T1 or Q2/T3 | Active | aP | 74AUP2G157GS,115 ( 9352 927 83115 ) |
74AUP2G157GT | ![]() XSON8 (SOT833-1) | SOT833-1 | Reel 7” Q1/T1 or Q2/T3 | Active | a2P | 74AUP2G157GT,115 ( 9352 807 35115 ) |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
---|---|---|---|---|---|
74AUP2G157DC | 74AUP2G157DC,125 | 74AUP2G157DC | ![]() | Always Pb-free | |
74AUP2G157GN | 74AUP2G157GN,115 | 74AUP2G157GN | ![]() | Always Pb-free | |
74AUP2G157GS | 74AUP2G157GS,115 | 74AUP2G157GS | ![]() | Always Pb-free | |
74AUP2G157GT | 74AUP2G157GT,115 | 74AUP2G157GT | ![]() | Always Pb-free |
Documentation (15)
File name | Title | Type | Date |
---|---|---|---|
74AUP2G157 | Low-power 2-input multiplexer | Data sheet | 2020-12-01 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11052 | Pin FMEA for AUP family | Application note | 2019-01-09 |
aup2g157 | aup2g157 IBIS model | IBIS model | 2013-04-07 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
MAR_SOT1116 | MAR_SOT1116 Topmark | Top marking | 2013-06-03 |
SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | Package information | 2022-06-02 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
aup2g157 | aup2g157 IBIS model | IBIS model | 2013-04-07 |
Ordering, pricing & availability
Sample
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Sample orders normally take 2-4 days for delivery.
If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples.