Features and benefits
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Automotive product qualification in accordance with AEC-Q100 (Grade 1)
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
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Wide supply voltage range from 2.0 to 6.0 V
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CMOS low power dissipation
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High noise immunity
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Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Input levels:
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For 74HC00-Q100: CMOS level
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For 74HCT00-Q100: TTL level
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Complies with JEDEC standards:
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JESD8C (2.7 V to 3.6 V)
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JESD7A (2.0 V to 6.0 V)
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- ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
Parametrics
| Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC00BQ-Q100 | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 7 | 36 | 4 | low | -40~125 | 107 | 21.7 | 75 | DHVQFN14 |
| 74HC00D-Q100 | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 7 | 36 | 4 | low | -40~125 | 109 | 20.9 | 68 | SO14 |
| 74HC00PW-Q100 | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 7 | 36 | 4 | low | -40~125 | 142 | 8.1 | 68 | TSSOP14 |
| 74HCT00BQ-Q100 | Production | 4.5 - 5.5 | TTL | ± 4 | 10 | 36 | 4 | low | -40~125 | 107 | 21.7 | 75 | DHVQFN14 |
| 74HCT00D-Q100 | Production | 4.5 - 5.5 | TTL | ± 4 | 10 | 36 | 4 | low | -40~125 | 109 | 20.9 | 68 | SO14 |
| 74HCT00PW-Q100 | Production | 4.5 - 5.5 | TTL | ± 4 | 10 | 36 | 4 | low | -40~125 | 142 | 8.1 | 68 | TSSOP14 |
Package
| Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
|---|---|---|---|---|---|---|---|
| 74HC00BQ-Q100 |  DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | HC00 | 74HC00BQ-Q100,115 ( 9352 986 83115 ) | |
| 74HC00D-Q100 |  SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_118 | Active | 74HC00D | 74HC00D-Q100,118 ( 9352 986 84118 ) |
| 74HC00PW-Q100 |  TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | HC00 | 74HC00PW-Q100,118 ( 9352 986 85118 ) |
| 74HCT00BQ-Q100 | DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | HCT00 | 74HCT00BQ-Q100,115 ( 9352 989 01115 ) | |
| 74HCT00D-Q100 | SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_118 | Active | 74HCT00D | 74HCT00D-Q100,118 ( 9352 989 02118 ) |
| 74HCT00PW-Q100 | TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | HCT00 | 74HCT00PW-Q100,118 ( 9352 989 03118 ) |
Discontinuation information
| Type number | Orderable part number, (Ordering code (12NC)) | Last time buy date | Last time delivery date | Replacement product | Status | Comments |
|---|---|---|---|---|---|---|
| 74HC00D-Q100/AU | 935690651118 | 2018-12-31 | 2019-06-30 | 74HC00D-Q100 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
|---|---|---|---|---|---|
| 74HC00BQ-Q100 | 74HC00BQ-Q100,115 | 74HC00BQ-Q100 |  |   | Always Pb-free |
| 74HC00D-Q100 | 74HC00D-Q100,118 | 74HC00D-Q100 | | | Always Pb-free |
| 74HC00PW-Q100 | 74HC00PW-Q100,118 | 74HC00PW-Q100 | | | Always Pb-free |
| 74HCT00BQ-Q100 | 74HCT00BQ-Q100,115 | 74HCT00BQ-Q100 | | | Always Pb-free |
| 74HCT00D-Q100 | 74HCT00D-Q100,118 | 74HCT00D-Q100 | | | Always Pb-free |
| 74HCT00PW-Q100 | 74HCT00PW-Q100,118 | 74HCT00PW-Q100 | | | Always Pb-free |
Documentation (11)
| File name | Title | Type | Date |
|---|---|---|---|
| 74HC_HCT00_Q100 | Quad 2-input NAND gate | Data sheet | 2024-02-15 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| hct00 | 74HCT00 IBIS model | IBIS model | 2019-01-09 |
| hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
Support
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Ordering, pricing & availability
Sample
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