Features and benefits
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Automotive product qualification in accordance with AEC-Q100 (Grade 1)
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
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Wide supply voltage range from 2.0 V to 6.0 V
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CMOS low power dissipation
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High noise immunity
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Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Complies with JEDEC standards:
- JESD8C (2.7 V to 3.6 V)
- JESD7A (2.0 V to 6.0 V)
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Input levels:
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For 74HC157-Q100: CMOS level
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For 74HCT157-Q100: TTL level
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Non-inverting data path
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ESD protection:
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MIL-STD-883, method 3015 exceeds 2000 V
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HBM JESD22-A114F exceeds 2000 V
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MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)
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Multiple package options
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DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
Parametrics
| Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC157BQ-Q100 | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 11 | low | -40~125 | 92 | 13.1 | 61 | DHVQFN16 |
| 74HC157D-Q100 | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 11 | low | -40~125 | 92 | 9.2 | 51 | SO16 |
| 74HC157PW-Q100 | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 11 | low | -40~125 | 124 | 4.4 | 53.6 | TSSOP16 |
| 74HCT157BQ-Q100 | Production | 4.5 - 5.5 | TTL | ± 4 | 13 | low | -40~125 | 92 | 13.1 | 61 | DHVQFN16 |
| 74HCT157D-Q100 | Production | 4.5 - 5.5 | TTL | ± 4 | 13 | low | -40~125 | 92 | 9.2 | 51 | SO16 |
| 74HCT157PW-Q100 | Production | 4.5 - 5.5 | TTL | ± 4 | 13 | low | -40~125 | 124 | 4.4 | 53.6 | TSSOP16 |
Package
| Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
|---|---|---|---|---|---|---|---|
| 74HC157BQ-Q100 |  DHVQFN16 (SOT763-1) | SOT763-1 | SOT763-1_115 | Active | HC157 | 74HC157BQ-Q100,115 ( 9352 989 04115 ) | |
| 74HC157D-Q100 |  SO16 (SOT109-1) | SOT109-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT109-1_118 | Active | 74HC157D | 74HC157D-Q100,118 ( 9352 989 05118 ) |
| 74HC157PW-Q100 |  TSSOP16 (SOT403-1) | SOT403-1 | SSOP-TSSOP-VSO-WAVE | SOT403-1_118 | Active | HC157 | 74HC157PW-Q100,118 ( 9352 989 06118 ) |
| 74HCT157BQ-Q100 | DHVQFN16 (SOT763-1) | SOT763-1 | SOT763-1_115 | Active | HCT157 | 74HCT157BQ-Q100,11 ( 9352 989 07115 ) | |
| 74HCT157D-Q100 | SO16 (SOT109-1) | SOT109-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT109-1_118 | Active | 74HCT157D | 74HCT157D-Q100,118 ( 9352 989 08118 ) |
| 74HCT157PW-Q100 | TSSOP16 (SOT403-1) | SOT403-1 | SSOP-TSSOP-VSO-WAVE | SOT403-1_118 | Active | HCT157 | 74HCT157PW-Q100,11 ( 9352 989 09118 ) |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
|---|---|---|---|---|---|
| 74HC157BQ-Q100 | 74HC157BQ-Q100,115 | 74HC157BQ-Q100 |  |   | Always Pb-free |
| 74HC157D-Q100 | 74HC157D-Q100,118 | 74HC157D-Q100 | | | Always Pb-free |
| 74HC157PW-Q100 | 74HC157PW-Q100,118 | 74HC157PW-Q100 | | | Always Pb-free |
| 74HCT157BQ-Q100 | 74HCT157BQ-Q100,11 | 74HCT157BQ-Q100 | | | Always Pb-free |
| 74HCT157D-Q100 | 74HCT157D-Q100,118 | 74HCT157D-Q100 | | | Always Pb-free |
| 74HCT157PW-Q100 | 74HCT157PW-Q100,11 | 74HCT157PW-Q100 | | | Always Pb-free |
Documentation (8)
| File name | Title | Type | Date |
|---|---|---|---|
| 74HC_HCT157_Q100 | Quad 2-input multiplexer | Data sheet | 2020-07-24 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Ordering, pricing & availability
Sample
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