74AHC273-Q100; 74AHCT273-Q100

Octal D-type flip-flop with reset; positive-edge trigger

The 74AHC273-Q100; 74AHCT273-Q100 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7-A.

The 74AHC273-Q100; 74AHCT273-Q100 has eight edge-triggered, D-type flip-flops with individual D inputs and Q outputs. The common clock (CP) and master reset (MR) inputs, load and reset (clear) all flip-flops simultaneously. The state of each D input, one set-up time before the LOW-to-HIGH clock transition, is transferred to the corresponding output (Qn) of the flip-flop. All outputs will be forced LOW, independent of clock or data inputs, by a LOW on the MR input.

The device is useful for applications where only the true output is required and the clock and master reset are common to all storage elements.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)
    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C
  • Balanced propagation delays
  • All inputs have Schmitt-trigger actions
  • Inputs accept voltages higher than VCC
  • Ideal buffer for MOS microcontroller or memory
  • Common clock and master reset
  • Input levels:
    • For 74AHC273-Q100: CMOS level
    • For 74AHCT273-Q100: TTL level
  • ESD protection:
    • MIL-STD-883, method 3015 exceeds 2000 V
    • HBM JESD22-A114F exceeds 2000 V
    • MM JESD22-A115-A exceeds 200 V (C = 200 pf, R = 0 Ω)
  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints


Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AHC273BQ-Q100Production2.0 - 5.5CMOS± 84.2165low-40~125789.150DHVQFN20
74AHC273D-Q100Production2.0 - 5.5CMOS± 84.2165low-40~1258527.361SO20
74AHC273PW-Q100Production2.0 - 5.5CMOS± 84.2165low-40~1251004.644.7TSSOP20
74AHCT273BQ-Q100Production4.5 - 5.5TTL± 84120low-40~125789.150DHVQFN20
74AHCT273D-Q100Production4.5 - 5.5TTL± 84120low-40~1258527.361SO20
74AHCT273PW-Q100Production4.5 - 5.5TTL± 84120low-40~1251004.644.7TSSOP20


Type numberPackagePackage informationReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
SOT764-1Reel 7” Q1/T1 or Q2/T3ActiveAHC27374AHC273BQ-Q100X
( 9353 001 87115 )
Reel 13" Q1/T1Active74AHC273D74AHC273D-Q100J
( 9353 001 88118 )
Reel 13" Q1/T1ActiveAHC27374AHC273PW-Q100J
( 9353 001 89118 )
SOT764-1Reel 7” Q1/T1 or Q2/T3ActiveAHCT27374AHCT273BQ-Q100X
( 9353 002 05115 )
Reel 13" Q1/T1Active74AHCT273D74AHCT273D-Q100J
( 9353 002 06118 )
Reel 13" Q1/T1ActiveAHCT27374AHCT273PW-Q100J
( 9353 002 07118 )

Quality, reliability & chemical content

Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateEFRIFRMTBF (hour)MSLMSL leadfree
74AHC273BQ-Q10074AHC273BQ-Q100X74AHC273BQ-Q100Always Pb-free29.90.91.11E911
74AHC273D-Q10074AHC273D-Q100J74AHC273D-Q100Always Pb-free29.90.91.11E911
74AHC273PW-Q10074AHC273PW-Q100J74AHC273PW-Q100Always Pb-free29.90.91.11E911
74AHCT273BQ-Q10074AHCT273BQ-Q100X74AHCT273BQ-Q100Always Pb-free29.90.91.11E911
74AHCT273D-Q10074AHCT273D-Q100J74AHCT273D-Q100Always Pb-free29.90.91.11E911
74AHCT273PW-Q10074AHCT273PW-Q100J74AHCT273PW-Q100Always Pb-free29.90.91.11E911
Quality and reliability disclaimer

Documentation (8)

File nameTitleTypeDate
74AHC_AHCT273_Q100Octal D-type flip-flop with reset; positive-edge triggerData sheet2020-09-22
ahct273ahct273 IBIS modelIBIS model2013-04-07
ahc273ahc273 IBIS modelIBIS model2013-04-07
SOT764-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm bodyPackage information2021-08-17
SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08
SOT360-1plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm bodyPackage information2020-04-21
SOT163-1plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm bodyPackage information2020-04-21
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08


If you are in need of design/technical support, let us know and fill in the answer form, we'll get back to you shortly.


File nameTitleTypeDate
ahct273ahct273 IBIS modelIBIS model2013-04-07
ahc273ahc273 IBIS modelIBIS model2013-04-07


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