74AHC74-Q100; 74AHCT74-Q100

Dual D-type flip-flop with set and reset; positive-edge trigger

The 74AHC74-Q100; 74AHCT74-Q100 is a high-speed Si-gate CMOS device and is pin compatible with Low-Power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7-A.

The 74AHC74-Q100; 74AHCT74-Q100 is a dual positive-edge triggered, D-type flip-flop with individual data inputs (D), clock inputs (CP), set inputs (SD) and reset inputs (RD). It also has complementary outputs (Q and Q).

The set and reset are asynchronous active LOW inputs that operate independent of the clock input. Information on the data input is transferred to the Q output on the LOW to HIGH transition of the clock pulse. The data inputs must be stable one set-up time prior to the LOW to HIGH clock transition for predictable operation.

Schmitt-trigger action in the clock input makes the circuit highly tolerant to slower clock rise and fall times.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)
    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C
  • Balanced propagation delays
  • All inputs have Schmitt-trigger actions
  • Inputs accept voltages higher than VCC
  • Input levels:
    • For 74AHC74-Q100: CMOS level
    • For 74AHCT74-Q100: TTL level
  • ESD protection:
    • MIL-STD-883, method 3015 exceeds 2000 V
    • HBM JESD22-A114F exceeds 2000 V
    • MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)
  • Multiple package options
  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints


Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AHC74BQ-Q100Production2.0 - 5.5CMOS± 83.7170low-40~12510620.974DHVQFN14
74AHC74D-Q100Production2.0 - 5.5CMOS± 83.7170low-40~12510820.166SO14
74AHC74PW-Q100Production2.0 - 5.5CMOS± 83.7170low-40~1251417.868TSSOP14
74AHCT74BQ-Q100Production4.5 - 5.5TTL± 83.3160low-40~12510620.974DHVQFN14
74AHCT74D-Q100Production4.5 - 5.5TTL± 83.3160low-40~12510820.166SO14
74AHCT74PW-Q100Production4.5 - 5.5TTL± 83.3160low-40~1251417.868TSSOP14


Type numberPackagePackage informationReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
SOT762-1Reel 7” Q1/T1 or Q2/T3ActiveAHC7474AHC74BQ-Q100X
( 9353 003 22115 )
Reel 13" Q1/T1Active74AHC74D74AHC74D-Q100J
( 9353 003 23118 )
Reel 13" Q1/T1ActiveAHC7474AHC74PW-Q100J
( 9353 003 24118 )
SOT762-1Reel 7” Q1/T1 or Q2/T3ActiveAHT7474AHCT74BQ-Q100X
( 9353 003 25115 )
Reel 13" Q1/T1Active74AHCT74D74AHCT74D-Q100J
( 9353 003 26118 )
Reel 13" Q1/T1ActiveAHCT7474AHCT74PW-Q100J
( 9353 003 27118 )

Quality, reliability & chemical content

Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateEFRIFRMTBF (hour)MSLMSL leadfree
74AHC74BQ-Q10074AHC74BQ-Q100X74AHC74BQ-Q100Always Pb-free29.90.91.11E911
74AHC74D-Q10074AHC74D-Q100J74AHC74D-Q100Always Pb-free29.90.91.11E911
74AHC74PW-Q10074AHC74PW-Q100J74AHC74PW-Q100Always Pb-free29.90.91.11E911
74AHCT74BQ-Q10074AHCT74BQ-Q100X74AHCT74BQ-Q100Always Pb-free29.90.91.11E911
74AHCT74D-Q10074AHCT74D-Q100J74AHCT74D-Q100Always Pb-free29.90.91.11E911
74AHCT74PW-Q10074AHCT74PW-Q100J74AHCT74PW-Q100Always Pb-free29.90.91.11E911
Quality and reliability disclaimer

Documentation (10)

File nameTitleTypeDate
74AHC_AHCT74_Q100Dual D-type flip-flop with set and reset; positive-edge triggerData sheet2020-04-22
ahc74ahc74 IBIS modelIBIS model2013-04-07
ahct74ahct74 IBIS modelIBIS model2013-04-07
SOT762-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 3 mm x 2.5 mm x 1 mm bodyPackage information2021-08-17
SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08
SOT402-1plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm bodyPackage information2020-04-21
SO-SOJ-WAVEFootprint for wave solderingWave soldering2009-10-08
SO-SOJ-REFLOWFootprint for reflow solderingReflow soldering2009-10-08
SOT108-1plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm bodyPackage information2021-01-06
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08


If you are in need of design/technical support, let us know and fill in the answer form, we'll get back to you shortly.


File nameTitleTypeDate
ahc74ahc74 IBIS modelIBIS model2013-04-07
ahct74ahct74 IBIS modelIBIS model2013-04-07


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