74HC373-Q100; 74HCT373-Q100

Octal D-type transparent latch; 3-state

The 74HC373-Q100; 74HCT373-Q100 is an octal D-type transparent latch with 3-state outputs. The device features latch enable (LE) and output enable (OE) inputs. When LE is HIGH, data at the inputs enter the latches. In this condition the latches are transparent, a latch output will change each time its corresponding D-input changes. When LE is LOW the latches store the information that was present at the inputs a set-up time preceding the HIGH-to-LOW transition of LE. A HIGH on OE causes the outputs to assume a high-impedance OFF-state. Operation of the OE input does not affect the state of the latches. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)
    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C
  • Wide supply voltage range from 2.0 V to 6.0 V
  • CMOS low power dissipation
  • High noise immunity
  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
  • Complies with JEDEC standards:
    • JESD8C (2.7 V to 3.6 V)
    • JESD7A (2.0 V to 6.0 V)
  • Input levels:
    • For 74HC373-Q100: CMOS level
    • For 74HCT373-Q100: TTL level
  • 3-state non-inverting outputs for bus-oriented applications
  • Common 3-state output enable input
  • ESD protection:
    • MIL-STD-883, method 3015 exceeds 2000 V
    • HBM JESD22-A114F exceeds 2000 V
    • MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)
  • Multiple package options
  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints


Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74HC373BQ-Q100Production2.0 - 6.0CMOS± 7.8128low-40~125789.150DHVQFN20
74HC373D-Q100Production2.0 - 6.0CMOS± 7.8128low-40~1258527.361SO20
74HC373PW-Q100Production2.0 - 6.0CMOS± 7.8128low-40~1251004.644.7TSSOP20
74HCT373BQ-Q100Production4.5 - 5.5TTL± 6148low-40~125789.150DHVQFN20
74HCT373D-Q100Production4.5 - 5.5TTL± 6148low-40~1258527.361SO20
74HCT373PW-Q100Production4.5 - 5.5TTL± 6148low-40~1251004.644.7TSSOP20


Type numberPackagePackage informationReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
SOT764-1Reel 7” Q1/T1 or Q2/T3ActiveHC373BQ74HC373BQ-Q100,115
( 9352 990 34115 )
Reel 13" Q1/T1Active74HC373D74HC373D-Q100,118
( 9352 990 35118 )
Reel 13" Q1/T1ActiveHC37374HC373PW-Q100,118
( 9352 990 36118 )
SOT764-1Reel 7” Q1/T1 or Q2/T3ActiveHCT373BQ74HCT373BQ-Q100,11
( 9352 990 37115 )
Reel 13" Q1/T1Active74HCT373D74HCT373D-Q100,118
( 9352 990 38118 )
Reel 13" Q1/T1ActiveHCT37374HCT373PW-Q100,11
( 9352 990 39118 )

Quality, reliability & chemical content

Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateEFRIFRMTBF (hour)MSLMSL leadfree
74HC373BQ-Q10074HC373BQ-Q100,11574HC373BQ-Q100Always Pb-free29.90.91.11E911
74HC373D-Q10074HC373D-Q100,11874HC373D-Q100Always Pb-free29.90.91.11E911
74HC373PW-Q10074HC373PW-Q100,11874HC373PW-Q100Always Pb-free29.90.91.11E911
74HCT373BQ-Q10074HCT373BQ-Q100,1174HCT373BQ-Q100Always Pb-free29.90.91.11E911
74HCT373D-Q10074HCT373D-Q100,11874HCT373D-Q100Always Pb-free29.90.91.11E911
74HCT373PW-Q10074HCT373PW-Q100,1174HCT373PW-Q100Always Pb-free29.90.91.11E911
Quality and reliability disclaimer

Documentation (9)

File nameTitleTypeDate
74HC_HCT373_Q100Octal D-type transparent latch; 3-stateData sheet2020-07-22
AN11044Pin FMEA 74HC/74HCT familyApplication note2019-01-09
hchc Spice modelSPICE model2013-05-06
HCT_USER_GUIDEHC/T User GuideUser manual1997-10-31
SOT764-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm bodyPackage information2021-08-17
SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08
SOT360-1plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm bodyPackage information2020-04-21
SOT163-1plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm bodyPackage information2020-04-21
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08


If you are in need of design/technical support, let us know and fill in the answer form, we'll get back to you shortly.


File nameTitleTypeDate
hchc Spice modelSPICE model2013-05-06


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