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74LVC1T45GM-Q100

Dual supply translating transceiver; 3-state

The 74LVC1T45-Q100; 74LVCH1T45-Q100 are single bit, dual supply transceivers with 3-state outputs that enable bidirectional level translation. They feature two 1-bit input-output ports (A and B), a direction control input (DIR) and dual supply pins (VCC(A) and VCC(B)). Both VCC(A) and VCC(B) can be supplied with any voltage between 1.2 V and 5.5 V. This flexibility makes the device suitable for translating between any of the low voltage nodes (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V and 5.0 V). Pins A and DIR are referenced to VCC(A) and pin B is referenced to VCC(B). A HIGH on DIR allows transmission from A to B and a LOW on DIR allows transmission from B to A.

The devices are fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing any damaging backflow current through the device when it is powered down. In suspend mode when either VCC(A) or VCC(B) are at GND level, both A port and B port are in the high-impedance OFF-state.

Active bus hold circuitry in the 74LVCH1T45-Q100 holds unused or floating data inputs at a valid logic level.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range:

    • VCC(A): 1.2 V to 5.5 V

    • VCC(B): 1.2 V to 5.5 V

  • High noise immunity

  • Maximum data rates:

    • 420 Mbps (3.3 V to 5.0 V translation)

    • 210 Mbps (translate to 3.3 V))

    • 140 Mbps (translate to 2.5 V)

    • 75 Mbps (translate to 1.8 V)

    • 60 Mbps (translate to 1.5 V)

  • Suspend mode

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • ±24 mA output drive (VCC = 3.0 V)

  • Inputs accept voltages up to 5.5 V

  • Low power consumption: 16 μA maximum ICC

  • IOFF circuitry provides partial Power-down mode operation

  • Complies with JEDEC standards:

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

Parametrics

Type number Product status VCC(A) (V) VCC(B) (V) Logic switching levels Output drive capability (mA) tpd (ns) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74LVC1T45GM-Q100 Production 1.2 - 5.5 1.2 - 5.5 CMOS/LVTTL ± 24 2.5 1 low -40~125 294 6.8 147 XSON6

PCB Symbol, Footprint and 3D Model

Model Name Description

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
74LVC1T45GM-Q100 74LVC1T45GM-Q100X
(935690846115)
Active V5 SOT886
XSON6
(SOT886)
SOT886 REFLOW_BG-BD-1
SOT886_115

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
74LVC1T45GM-Q100 74LVC1T45GM-Q100X 74LVC1T45GM-Q100 rohs rhf rhf
Quality and reliability disclaimer

Documentation (15)

File name Title Type Date
74LVC_LVCH1T45_Q100 Dual supply translating transceiver; 3-state Data sheet 2023-08-04
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11009 Pin FMEA for LVC family Application note 2019-01-09
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
lvc1t45 lvc1t45 IBIS model IBIS model 2013-04-08
Nexperia_document_leaflet_Logic_Automotive_MicroPak_solutions_201904 Automotive logic in MicroPak leadless packages Leaflet 2019-04-18
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT886_115 XSON6; Reel pack for SMD, 7''; Q1/T1 product orientation Packing information 2020-04-21
74LVC1T45GM-Q100_Nexperia_Product_Reliability 74LVC1T45GM-Q100 Nexperia Product Reliability Quality document 2024-06-16
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03

Support

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Models

File name Title Type Date
lvc1t45 lvc1t45 IBIS model IBIS model 2013-04-08
SOT886 3D model for products with SOT886 package Design support 2019-10-03

PCB Symbol, Footprint and 3D Model

Model Name Description

Ordering, pricing & availability

Type number Orderable part number Ordering code (12NC) Status Packing Packing Quantity Buy online
74LVC1T45GM-Q100 74LVC1T45GM-Q100X 935690846115 Active SOT886_115 5,000 Order product

Sample

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If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

Orderable parts

Type number Orderable part number Ordering code (12NC) Package Buy from distributors
74LVC1T45GM-Q100 74LVC1T45GM-Q100X 935690846115 SOT886 Order product