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Chemical content 74HCT4066BQ

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Type numberPackagePackage descriptionTotal product weight
74HCT4066BQSOT762-1DHVQFN1421.96654 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352737271151412601235Bangkok, Thailand; Nijmegen, Netherlands; Shanghai, China; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43028
PolymerResin systemProprietary0.0234819.900000.10690
subTotal0.11800100.000000.53718
DieDoped siliconSilicon (Si)7440-21-30.35253100.000001.60485
subTotal0.35253100.000001.60485
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.36144
Iron (Fe)7439-89-60.205522.346100.93560
Phosphorus (P)7723-14-00.002650.030200.01204
Zinc (Zn)7440-66-60.008890.101500.04048
Pure metal layerGold (Au)7440-57-50.002650.030200.01204
Nickel (Ni)7440-02-00.106921.220500.48672
Palladium (Pd)7440-05-30.004910.056000.02233
Silver (Ag)7440-22-40.001800.020500.00818
subTotal8.76000100.0000039.87883
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.68057
FillerSilica -amorphous-7631-86-90.442743.490002.01553
Silica fused60676-86-010.7602784.8200048.98480
PigmentCarbon black1333-86-40.020300.160000.09240
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62372
Epoxy resin systemProprietary0.201711.590000.91825
Phenolic resinProprietary0.285442.250001.29941
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.13680
subTotal12.68600100.0000057.75148
WirePure metalCopper (Cu)7440-50-80.0482896.550000.21980
Pure metal layerGold (Au)7440-57-50.000180.350000.00080
Palladium (Pd)7440-05-30.001553.100000.00706
subTotal0.05001100.000000.22766
total21.96654100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.