Bipolar transistors


ESD protection, TVS, filtering and signal conditioning





Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC2G38GX

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Type numberPackagePackage descriptionTotal product weight
74LVC2G38GXSOT1233-2X2SON81.05020 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
9353397991156126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05546100.000005.28079
ComponentAdditiveNon hazardousProprietary0.000255.000000.02380
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02380
Silica -amorphous-7631-86-90.0025050.000000.23805
PolymerEpoxy resin systemProprietary0.0015030.000000.14283
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.04761
Lead FrameCopper alloyCopper (Cu)7440-50-80.3865594.5100036.80688
Magnesium (Mg)7439-95-40.000610.150000.05842
Nickel (Ni)7440-02-00.012072.950001.14888
Silicon (Si)7440-21-30.002620.640000.24925
Pure metal layerGold (Au)7440-57-50.000080.020000.00779
Nickel (Ni)7440-02-00.006711.640000.63870
Palladium (Pd)7440-05-30.000370.090000.03505
Mould CompoundAdditiveNon hazardousProprietary0.002300.410000.21941
FillerSilica -amorphous-7631-86-90.001630.290000.15519
Silica fused60676-86-00.4841686.1500046.10198
HardenerPhenolic resinProprietary0.024114.290002.29573
PigmentCarbon black1333-86-40.001070.190000.10168
PolymerEpoxy resin systemProprietary0.048738.670004.63963
WireGold alloyGold (Au)7440-57-50.0185599.000001.76679
Palladium (Pd)7440-05-30.000191.000000.01785
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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