Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAT854CW-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAT854CW-QSOT323SC-705.587487 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346644801152126030 s123520 s3
9346644801352126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.100000100.0000001.789713
subTotal0.100000100.0000001.789713
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016650.0900000.029799
Carbon (C)7440-44-00.0007400.0400000.013244
Chromium (Cr)7440-47-30.0016650.0900000.029799
Cobalt (Co)7440-48-40.0079550.4300000.142372
Iron (Fe)7439-89-60.82602544.65000014.783480
Manganese (Mn)7439-96-50.0127650.6900000.228457
Nickel (Ni)7440-02-00.63899034.54000011.436089
Phosphorus (P)7723-14-00.0003700.0200000.006622
Silicon (Si)7440-21-30.0048100.2600000.086085
Sulphur (S)7704-34-90.0003700.0200000.006622
Pure metal layerCopper (Cu)7440-50-80.31172516.8500005.578984
Silver (Ag)7440-22-40.0429202.3200000.768145
subTotal1.850000100.00000033.109697
Mould CompoundFillerSilica fused60676-86-02.55340075.10000045.698540
PigmentCarbon black1333-86-40.0102000.3000000.182551
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.59500017.50000010.648794
Phenol Formaldehyde resin (generic)9003-35-40.2414007.1000004.320368
subTotal3.400000100.00000060.850253
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000070.0030000.000123
Bismuth (Bi)7440-69-90.0000020.0010000.000041
Copper (Cu)7440-50-80.0000020.0010000.000041
Lead (Pb)7439-92-10.0000120.0050000.000206
Tin solderTin (Sn)7440-31-50.22997799.9900004.115929
subTotal0.230000100.0000004.116341
WirePure metalCopper (Cu)7440-50-80.007487100.0000000.134000
subTotal0.007487100.0000000.134000
total5.587487100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.