Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAW56SRA-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAW56SRA-QSOT1268-1DFN1412-62.368000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346652541471126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.10640076.0000004.493243
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.01465810.4700000.619003
Phenolic resinProprietary0.01894213.5300000.799916
subTotal0.140000100.0000005.912162
DieDoped siliconSilicon (Si)7440-21-30.080000100.0000003.378378
subTotal0.080000100.0000003.378378
Lead FrameCopper alloyCopper (Cu)7440-50-80.91850995.67800038.788378
Magnesium (Mg)7439-95-40.0014320.1492000.060486
Nickel (Ni)7440-02-00.0286442.9837001.209608
Silicon (Si)7440-21-30.0062060.6465000.262095
Pure metal layerGold (Au)7440-57-50.0001090.0114000.004622
Nickel (Ni)7440-02-00.0047570.4955000.200878
Palladium (Pd)7440-05-30.0003430.0357000.014473
subTotal0.960000100.00000040.540541
Mould CompoundFillerSilica -amorphous-7631-86-90.25990023.00000010.975507
Silica fused60676-86-00.67800060.00000028.631757
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0339003.0000001.431588
Ion trapping agentBismuth (Bi)7440-69-90.0056500.5000000.238598
PigmentCarbon black1333-86-40.0056500.5000000.238598
PolymerEpoxy resin systemProprietary0.0791007.0000003.340372
Phenolic resinProprietary0.0678006.0000002.863176
subTotal1.130000100.00000047.719595
Post-PlatingImpurityLead (Pb)7439-92-10.0000020.0045000.000095
Non hazardousProprietary0.0000280.0555000.001172
Tin solderTin (Sn)7440-31-50.04997099.9400002.110220
subTotal0.050000100.0000002.111486
WireImpurityNon hazardousProprietary0.0000010.0100000.000034
Pure metalGold (Au)7440-57-50.00799999.9900000.337804
subTotal0.008000100.0000000.337838
total2.368000100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.