Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC806-16W

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC806-16WSOT323SC-705.578768 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346611251153126030 s123520 s3
9346611251354126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.094000100.0000001.684960
subTotal0.094000100.0000001.684960
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016650.0900000.029845
Carbon (C)7440-44-00.0007400.0400000.013265
Chromium (Cr)7440-47-30.0016650.0900000.029845
Cobalt (Co)7440-48-40.0079550.4300000.142594
Iron (Fe)7439-89-60.82602544.65000014.806585
Manganese (Mn)7439-96-50.0127650.6900000.228814
Nickel (Ni)7440-02-00.63899034.54000011.453963
Phosphorus (P)7723-14-00.0003700.0200000.006632
Silicon (Si)7440-21-30.0048100.2600000.086220
Sulphur (S)7704-34-90.0003700.0200000.006632
Pure metal layerCopper (Cu)7440-50-80.31172516.8500005.587703
Silver (Ag)7440-22-40.0429202.3200000.769345
subTotal1.850000100.00000033.161444
Mould CompoundFillerSilica fused60676-86-02.55340075.10000045.769962
PigmentCarbon black1333-86-40.0102000.3000000.182836
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.59500017.50000010.665437
Phenol Formaldehyde resin (generic)9003-35-40.2414007.1000004.327120
subTotal3.400000100.00000060.945356
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000070.0030000.000124
Bismuth (Bi)7440-69-90.0000020.0010000.000041
Copper (Cu)7440-50-80.0000020.0010000.000041
Lead (Pb)7439-92-10.0000120.0050000.000206
Tin solderTin (Sn)7440-31-50.22997799.9900004.122362
subTotal0.230000100.0000004.122774
WireImpurityNon hazardousProprietary0.0000000.0100000.000009
Pure metalCopper (Cu)7440-50-80.00476899.9900000.085458
subTotal0.004768100.0000000.085467
total5.578768100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.