Chemical content BUK7S1R5-40H

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

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Type number	Package	Package description	Total product weight
BUK7S1R5-40H	SOT1235	LFPAK88	336.43000 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934661102118	4	1	260		1	260			Manchester, United Kingdom; Seremban, Malaysia; Newport, United Kingdom; Cabuyao, Philippines; Hsin-chu, Taiwan

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	1.20000	100.00000	0.35669
		subTotal		1.20000	100.00000	0.35669

Clip	Copper alloy	Copper (Cu)	7440-50-8	43.14451	99.86000	12.82422
		Iron (Fe)	7439-89-6	0.04753	0.11000	0.01413
		Phosphorus (P)	7723-14-0	0.01296	0.03000	0.00385
		subTotal		43.20500	100.00000	12.84220

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	172.92756	99.86000	51.40076
		Iron (Fe)	7439-89-6	0.22512	0.13000	0.06691
		Phosphorus (P)	7723-14-0	0.05195	0.03000	0.01544
		subTotal		173.17000	100.00000	51.48311

Mould Compound	Filler	Silica fused	60676-86-0	63.33300	62.00000	18.82502
	Flame retardant	Aluminium Hydroxide (Al(OH)3)	21645-51-2	15.83325	15.50000	4.70625
	Impurity	Silicon Dioxide (SiO2)	14808-60-7	0.20430	0.20000	0.06073
	Pigment	Carbon black	1333-86-4	0.51075	0.50000	0.15181
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	11.23650	11.00000	3.33992
		Phenolic resin	Proprietary	8.98920	8.80000	2.67194
		Tetramethylbiphenyl diglycidyl ether	85954-11-6	2.04300	2.00000	0.60726
		subTotal		102.15000	100.00000	30.36293

Post-Plating	Impurity	Non hazardous	Proprietary	0.00049	0.01000	0.00015
	Tin alloy	Tin (Sn)	7440-31-5	4.87951	99.99000	1.45038
		subTotal		4.88000	100.00000	1.45053

Solder Paste	Impurity	Antimony (Sb)	7440-36-0	0.00248	0.03000	0.00074
	Lead alloy	Lead (Pb)	7439-92-1	7.64727	92.47000	2.27306
		Silver (Ag)	7440-22-4	0.20675	2.50000	0.06145
		Tin (Sn)	7440-31-5	0.41350	5.00000	0.12291
		subTotal		8.27000	100.00000	2.45816

Solder Paste	Impurity	Antimony (Sb)	7440-36-0	0.00142	0.04000	0.00042
	Lead alloy	Lead (Pb)	7439-92-1	3.28268	92.47000	0.97574
	Silver alloy	Silver (Ag)	7440-22-4	0.08875	2.50000	0.02638
	Tin alloy	Tin (Sn)	7440-31-5	0.17750	5.00000	0.05276
		subTotal		3.55000	100.00000	1.05530

		total		336.43000	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.