Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK9M9R5-40H

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9M9R5-40HSOT1210mLFPAK36.230000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346607961152126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.820000100.0000002.263318
subTotal0.820000100.0000002.263318
ClipCopper alloyCopper (Cu)7440-50-85.68860099.80000015.701352
Iron (Fe)7439-89-60.0085500.1500000.023599
Phosphorus (P)7723-14-00.0028500.0500000.007866
subTotal5.700000100.00000015.732818
Lead FrameCopper alloyCopper (Cu)7440-50-813.87220099.80000038.289263
Iron (Fe)7439-89-60.0208500.1500000.057549
Phosphorus (P)7723-14-00.0069500.0500000.019183
subTotal13.900000100.00000038.365995
Mould CompoundFillerSilica fused60676-86-05.28860062.00000014.597295
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.32215015.5000003.649324
ImpuritySilicon Dioxide (SiO2)14808-60-70.0170600.2000000.047088
PigmentCarbon black1333-86-40.0426500.5000000.117720
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.1706002.0000000.470880
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.93830011.0000002.589843
Phenolic resinProprietary0.7506408.8000002.071874
subTotal8.530000100.00000023.544024
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.001063
Tin alloyTin (Sn)7440-31-53.84961599.99000010.625490
subTotal3.850000100.00000010.626553
Solder PasteLead alloyLead (Pb)7439-92-13.17275092.5000008.757245
Silver (Ag)7440-22-40.0857502.5000000.236682
Tin (Sn)7440-31-50.1715005.0000000.473365
subTotal3.430000100.0000009.467292
total36.230000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.