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Chemical content PBSS5160QA

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Type numberPackagePackage descriptionTotal product weight
PBSS5160QASOT1215DFN1010D-31.27062 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067168147412601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000301.000000.02361
FillerSilver (Ag)7440-22-40.0252084.000001.98328
PolymerBismaleimidodiphenylmethane resin 0.0030010.000000.23611
Isobornyl Methacrylate7534-94-30.001505.000000.11805
subTotal0.03000100.000002.36105
DieDoped siliconSilicon (Si)7440-21-30.16000100.0000012.59228
subTotal0.16000100.0000012.59228
Lead FrameCopper alloyChromium (Cr)7440-47-30.001270.240000.10011
Copper (Cu)7440-50-80.5009094.5100039.42194
Tin (Sn)7440-31-50.001270.240000.10011
Zinc (Zn)7440-66-60.001110.210000.08760
Pure metal layerGold (Au)7440-57-50.000370.070000.02920
Nickel (Ni)7440-02-00.022954.330001.80613
Palladium (Pd)7440-05-30.002120.400000.16685
subTotal0.53000100.0000041.71194
Mould CompoundFillerSilica -amorphous-7631-86-90.1173023.000009.23171
Silica fused60676-86-00.3060060.0000024.08273
Flame retardantMetal hydroxideProprietary0.015303.000001.20414
ImpurityBismuth (Bi)7440-69-90.002550.500000.20069
PigmentCarbon black1333-86-40.002550.500000.20069
PolymerEpoxy resin systemProprietary0.035707.000002.80965
Phenolic resinProprietary0.030606.000002.40827
subTotal0.51000100.0000040.13788
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000020.055500.00131
Tin solderTin (Sn)7440-31-50.0299899.940002.35964
subTotal0.03000100.000002.36106
WireImpurityNon hazardousProprietary0.000000.010000.00008
Pure metalGold (Au)7440-57-50.0106199.990000.83541
subTotal0.01062100.000000.83549
total1.27062100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.