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Chemical content PESD15VS1UL

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Type numberPackagePackage descriptionTotal product weight
PESD15VS1ULSOD882DFN1006-20.94424 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340599783151312601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.80488
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11088
Phenolic resinProprietary0.0013513.530000.14329
subTotal0.01000100.000001.05905
DieDoped siliconSilicon (Si)7440-21-30.05000100.000005.29526
subTotal0.05000100.000005.29526
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.02866
Magnesium (Mg)7439-95-40.000820.200000.08684
Nickel (Ni)7440-02-00.012923.150001.36777
Silicon (Si)7440-21-30.002830.690000.29961
Pure metal layerGold (Au)7440-57-50.000120.030000.01303
Nickel (Ni)7440-02-00.005211.270000.55145
Palladium (Pd)7440-05-30.000700.170000.07382
subTotal0.41000100.0000043.42118
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000010.96120
Silica fused60676-86-00.2700060.0000028.59443
Flame retardantMetal hydroxideProprietary0.013503.000001.42972
ImpurityBismuth (Bi)7440-69-90.002250.500000.23829
PigmentCarbon black1333-86-40.002250.500000.23829
PolymerEpoxy resin systemProprietary0.031507.000003.33602
Phenolic resinProprietary0.027006.000002.85944
subTotal0.45000100.0000047.65739
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00118
Tin solderTin (Sn)7440-31-50.0199999.940002.11683
subTotal0.02000100.000002.11811
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0042499.990000.44899
subTotal0.00424100.000000.44903
total0.94424100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.