Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD3V3U1UL-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD3V3U1UL-QSOD882DFN1006-20.923233 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346655073151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.823194
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.113406
Phenolic resinProprietary0.00135313.5300000.146550
subTotal0.010000100.0000001.083150
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000003.249451
subTotal0.030000100.0000003.249451
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000041.962213
Magnesium (Mg)7439-95-40.0008200.2000000.088818
Nickel (Ni)7440-02-00.0129153.1500001.398888
Silicon (Si)7440-21-30.0028290.6900000.306423
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013323
Nickel (Ni)7440-02-00.0052071.2700000.563996
Palladium (Pd)7440-05-30.0006970.1700000.075496
subTotal0.410000100.00000044.409158
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000011.210604
Silica fused60676-86-00.27000060.00000029.245055
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.462253
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.243709
PigmentCarbon black1333-86-40.0022500.5000000.243709
PolymerEpoxy resin systemProprietary0.0315007.0000003.411923
Phenolic resinProprietary0.0270006.0000002.924506
subTotal0.450000100.00000048.741759
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000097
Non hazardousProprietary0.0000110.0555000.001202
Tin solderTin (Sn)7440-31-50.01998899.9400002.165001
subTotal0.020000100.0000002.166300
WireImpurityNon hazardousProprietary0.0000000.0100000.000035
Pure metalGold (Au)7440-57-50.00323399.9900000.350147
subTotal0.003233100.0000000.350182
total0.923233100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.