Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG2010BELD-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG2010BELD-QSOD882DDFN1006-20.737890 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346632193151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00228076.0000000.308989
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00031410.4700000.042567
Phenolic resinProprietary0.00040613.5300000.055008
subTotal0.003000100.0000000.406565
DieDoped siliconSilicon (Si)7440-21-30.080000100.00000010.841724
subTotal0.080000100.00000010.841724
Lead FrameCopper alloyChromium (Cr)7440-47-30.0008030.2575000.108878
Copper (Cu)7440-50-80.29576094.79500040.081909
Tin (Sn)7440-31-50.0007450.2388000.100971
Zinc (Zn)7440-66-60.0005950.1908000.080675
Pure metal layerGold (Au)7440-57-50.0001720.0550000.023255
Nickel (Ni)7440-02-00.0133914.2920001.814775
Palladium (Pd)7440-05-30.0005330.1709000.072261
subTotal0.312000100.00000042.282725
Mould CompoundFillerSilica -amorphous-7631-86-90.06877023.0000009.319817
Silica fused60676-86-00.17940060.00000024.312567
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0089703.0000001.215628
Ion trapping agentBismuth (Bi)7440-69-90.0014950.5000000.202605
PigmentCarbon black1333-86-40.0014950.5000000.202605
PolymerEpoxy resin systemProprietary0.0209307.0000002.836466
Phenolic resinProprietary0.0179406.0000002.431257
subTotal0.299000100.00000040.520945
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000134
Non hazardousProprietary0.0000120.0555000.001655
Tin solderTin (Sn)7440-31-50.02198799.9400002.979685
subTotal0.022000100.0000002.981474
WireImpurityNon hazardousProprietary0.0000020.0100000.000297
Pure metalGold (Au)7440-57-50.02188699.9900002.965999
subTotal0.021888100.0000002.966296
total0.737890100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.