Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG3002TV

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG3002TVSOT666SOT62.803220 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405963111514126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.100000100.0000003.567326
subTotal0.100000100.0000003.567326
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0009280.0800000.033105
Carbon (C)7440-44-00.0004640.0400000.016552
Chromium (Cr)7440-47-30.0024360.2100000.086900
Cobalt (Co)7440-48-40.0048720.4200000.173800
Iron (Fe)7439-89-60.54172046.70000019.324919
Manganese (Mn)7439-96-50.0097440.8400000.347600
Nickel (Ni)7440-02-00.40808835.18000014.557830
Phosphorus (P)7723-14-00.0002320.0200000.008276
Silicon (Si)7440-21-30.0029000.2500000.103452
Sulphur (S)7704-34-90.0002320.0200000.008276
Pure metal layerCopper (Cu)7440-50-80.14975612.9100005.342285
Silver (Ag)7440-22-40.0386283.3300001.377987
subTotal1.160000100.00000041.380983
Mould CompoundFillerSilica fused60676-86-01.04262171.00000037.193684
PigmentCarbon black1333-86-40.0044050.3000000.157156
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.28929119.70000010.319938
Phenolic resinProprietary0.1321639.0000004.714692
subTotal1.468480100.00000052.385471
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000020.0030000.000068
Bismuth (Bi)7440-69-90.0000010.0010000.000023
Copper (Cu)7440-50-80.0000010.0010000.000023
Lead (Pb)7439-92-10.0000030.0050000.000114
Tin solderTin (Sn)7440-31-50.06369499.9900002.272160
subTotal0.063700100.0000002.272387
WireImpurityNon hazardousProprietary0.0000010.0100000.000039
Pure metalGold (Au)7440-57-50.01103999.9900000.393793
subTotal0.011040100.0000000.393833
total2.803220100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.