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Chemical content PMEG3020CEP-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG3020CEP-QSOD128FlatPower33.71000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664425115112601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.43000100.000001.27559
subTotal0.43000100.000001.27559
ClipCopper alloyCopper (Cu)7440-50-87.2805299.8700021.59752
Iron (Fe)7439-89-60.007290.100000.02163
Phosphorus (P)7723-14-00.002190.030000.00649
subTotal7.29000100.0000021.62564
Lead FrameCopper alloyCopper (Cu)7440-50-811.6332498.4200034.50977
Iron (Fe)7439-89-60.011820.100000.03506
Phosphorus (P)7723-14-00.003550.030000.01052
Pure metal layerSilver (Ag)7440-22-40.171391.450000.50842
subTotal11.82000100.0000035.06377
Mould CompoundFillerSilica fused60676-86-08.0372071.0000023.84218
PigmentCarbon black1333-86-40.033960.300000.10074
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.2300419.700006.61537
Phenolic resinProprietary1.018809.000003.02225
subTotal11.32000100.0000033.58054
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.03816
subTotal0.35000100.000001.03826
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500006.85998
Silver alloySilver (Ag)7440-22-40.062502.500000.18540
Tin alloyTin (Sn)7440-31-50.125005.000000.37081
subTotal2.50000100.000007.41619
total33.71000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.