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Chemical content PMV65UNEA

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type numberPackagePackage descriptionTotal product weight
PMV65UNEASOT23TO-236AB7.81408 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340706912157126030 s123520 s3Hsin-chu, Taiwan; Seremban, Malaysia; Kwai Chung, Hong Kong; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.19000100.000002.43151
subTotal0.19000100.000002.43151
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.02936
Carbon (C)7440-44-00.001020.040000.01305
Chromium (Cr)7440-47-30.005610.220000.07177
Cobalt (Co)7440-48-40.010960.430000.14027
Iron (Fe)7439-89-61.2230147.9800015.65137
Manganese (Mn)7439-96-50.021920.860000.28054
Nickel (Ni)7440-02-00.9212136.1400011.78909
Phosphorus (P)7723-14-00.000510.020000.00652
Silicon (Si)7440-21-30.006630.260000.08481
Sulphur (S)7704-34-90.000510.020000.00652
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.70896
Silver (Ag)7440-22-40.065512.570000.83835
subTotal2.54900100.0000032.62061
Mould CompoundAdditiveNon hazardousProprietary0.141492.900001.81072
Triphenylphosphine603-35-00.002440.050000.03122
FillerSilica -amorphous-7631-86-93.5128872.0000044.95577
PigmentCarbon black1333-86-40.002440.050000.03122
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.7318515.000009.36579
Phenol Formaldehyde resin (generic)9003-35-40.4879010.000006.24386
subTotal4.87900100.0000062.43858
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.010000.00024
Bismuth (Bi)7440-69-90.000040.020000.00047
Iron (Fe)7439-89-60.000020.010000.00024
Lead (Pb)7439-92-10.000020.010000.00024
Tin solderTin (Sn)7440-31-50.1849199.950002.36634
subTotal0.18500100.000002.36753
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0110899.990000.14176
subTotal0.01108100.000000.14177
total7.81408100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.