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Chemical content PSMN012-100YSF

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Type numberPackagePackage descriptionTotal product weight
PSMN012-100YSFSOT669LFPAK73.03000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662281115212601260Manchester, United Kingdom; Sherman, United States Of America; Cabuyao, Philippines; Cardiff, Great BritainLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-32.16000100.000002.95769
subTotal2.16000100.000002.95769
ClipCopper alloyCopper (Cu)7440-50-84.9933899.867626.83744
Iron (Fe)7439-89-60.005000.099910.00684
Phosphorus (P)7723-14-00.001620.032470.00222
subTotal5.00000100.000006.84650
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100051.81154
Iron (Fe)7439-89-60.056860.150000.07787
Phosphorus (P)7723-14-00.015160.040000.02076
subTotal37.91000100.0000051.91017
Mould CompoundFillerSilica -amorphous-7631-86-92.2290010.000003.05217
Silica fused60676-86-016.7175075.0000022.89128
PigmentCarbon black1333-86-40.066870.300000.09157
PolymerEpoxy resin systemProprietary1.716337.700002.35017
Phenolic resinProprietary1.560307.000002.13652
subTotal22.29000100.0000030.52171
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00053
Tin alloyTin (Sn)7440-31-53.8496299.990005.27128
subTotal3.85000100.000005.27181
Solder PasteLead alloyLead (Pb)7439-92-11.2395092.500001.69725
Silver (Ag)7440-22-40.033502.500000.04587
Tin (Sn)7440-31-50.067005.000000.09174
subTotal1.34000100.000001.83486
Solder PasteImpurityAntimony (Sb)7440-36-00.000140.030000.00020
Lead alloyLead (Pb)7439-92-10.4438692.470000.60777
Silver alloySilver (Ag)7440-22-40.012002.500000.01643
Tin alloyTin (Sn)7440-31-50.024005.000000.03286
subTotal0.48000100.000000.65726
total73.03000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.