Chemical content PTVS10VU1UPA

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Type numberPackagePackage descriptionTotal product weight
PTVS10VU1UPASOT1061HUSON38.06751 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934068079147612601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01363
FillerSilver (Ag)7440-22-40.0924084.000001.14533
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.13635
Isobornyl Methacrylate7534-94-30.005505.000000.06817
DieDoped siliconSilicon (Si)7440-21-30.68000100.000008.42887
Lead FrameCopper alloyCopper (Cu)7440-50-82.6413794.2000032.74081
Magnesium (Mg)7439-95-40.008410.300000.10427
Nickel (Ni)7440-02-00.098143.500001.21648
Silicon (Si)7440-21-30.024390.870000.30238
Pure metal layerGold (Au)7440-57-50.001120.040000.01390
Nickel (Ni)7440-02-00.028041.000000.34757
Palladium (Pd)7440-05-30.002520.090000.03128
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.21650
FillerSilica -amorphous-7631-86-90.012350.290000.15313
Silica fused60676-86-03.6699986.1500045.49099
HardenerPhenolic resinProprietary0.182754.290002.26531
PigmentCarbon black1333-86-40.008090.190000.10033
PolymerEpoxy resin systemProprietary0.369348.670004.57814
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00009
Non hazardousProprietary0.000090.055500.00117
Tin solderTin (Sn)7440-31-50.1699099.940002.10595
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalCopper (Cu)7440-50-80.0435099.990000.53921
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.