Press releases

Nexperia releases industry’s first ESD protection ...

New products save space, cut costs and maintain signal integrity with ultra-low device ...

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• German

Nexperia reports resilient 2024 performance and ...

Nexperia today announced its financial results for the fiscal year 2024. Amid persistent ...

Nexperia launches industry leading ...

AEC-Q101-qualified SMD devices combine unmatched thermal stability and easy assembly

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• German
• Korean

Nexperia now offers automotive planar Schottky ...

Providing superior heat dissipation while still maintaining small footprint size

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• German
• Japanese

Harvard China College Forum Insight | Wing Zhang, ...

From April 4 to 6, the 28th Harvard China College Forum was successfully held. Wing Zhang, ...

Nexperia introduces new high speed optimized ...

New flip-chip land grid array (FC-LGA) packages deliver superior RF performance and ...

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Nexperia Chairman Wing Zhang’s Yale Summit Speech: ...

On March 30, 2025, the 11th Yale China-U.S. Summit was held simultaneously at the main venue in ...

12-channel LED driver from Nexperia supports ASIL-B ...

Reduced heating enables higher integration in space-constrained environments

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• Korean

Nexperia launches industry leading 1200 V SiC ...

New X.PAK packaging combines high thermal performance, compact size, and easy assembly for ...

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• German
• Japanese

Nexperia’s expanded GaN FET portfolio now supports ...

Latest additions ensure Nexperia retains the industry’s broadest GaN FET offering