Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK9M5R2-30E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9M5R2-30ESOT1210mLFPAK38.850000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340700741151126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.700000100.0000004.375804
subTotal1.700000100.0000004.375804
ClipCopper alloyCopper (Cu)7440-50-85.68860099.80000014.642471
Iron (Fe)7439-89-60.0085500.1500000.022008
Phosphorus (P)7723-14-00.0028500.0500000.007336
subTotal5.700000100.00000014.671815
Lead FrameCopper alloyCopper (Cu)7440-50-813.87220099.80000035.707079
Iron (Fe)7439-89-60.0208500.1500000.053668
Phosphorus (P)7723-14-00.0069500.0500000.017889
subTotal13.900000100.00000035.778636
Mould CompoundFillerSilica fused60676-86-05.28860062.00000013.612870
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.32215015.5000003.403218
ImpuritySilicon Dioxide (SiO2)14808-60-70.0170600.2000000.043912
PigmentCarbon black1333-86-40.0426500.5000000.109781
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.1706002.0000000.439125
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.93830011.0000002.415187
Phenolic resinProprietary0.7506408.8000001.932149
subTotal8.530000100.00000021.956242
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.000991
Tin alloyTin (Sn)7440-31-53.84961599.9900009.908919
subTotal3.850000100.0000009.909910
Solder PasteLead alloyLead (Pb)7439-92-14.78225092.50000012.309524
Silver (Ag)7440-22-40.1292502.5000000.332690
Tin (Sn)7440-31-50.2585005.0000000.665380
subTotal5.170000100.00000013.307593
total38.850000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.