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Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

74HCS237-Q100

3-to-8 line decoder/demultiplexer with address latches, Schmitt-trigger inputs

The 74HCS237-Q100 is a 3-to-8 line decoder, demultiplexer with latches at the three address inputs (An). The 74HCS237-Q100 essentially combines the 3-to-8 decoder function with a 3-bit storage latch. When the latch is enabled (LE = LOW), the 74HCS237-Q100 acts as a 3-to-8 active LOW decoder. When the latch enable (LE) goes from LOW-to-HIGH, the last data present at the inputs before this transition, is stored in the latches. Further address changes are ignored as long as LE remains HIGH. The output enable input (E1 and E2) controls the state of the outputs independent of the address inputs or latch operation. All outputs are HIGH unless E1 is LOW and E2 is HIGH. The 74HCS237-Q100 is ideally suited for implementing non-overlapping decoders in 3-state systems and strobes (stored address) applications in bus-oriented systems. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.

All inputs are Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 2.0 V to 6.0 V

  • Schmitt-trigger inputs
  • Low power consumption
    • Typical supply current (ICC) of 100 nA
    • Typical input leakage current (II) of ±10 nA
  • ±7.8 mA output drive at 6 V

  • Combines 3-to-8 decoder with 3-bit latch

  • Multiple input enable for easy expansion or independent controls

  • Active HIGH mutually exclusive outputs

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
  • Complies with JEDEC standards:
    • JESD7A (2.0 V to 6.0 V)

  • ESD protection:

    • HBM ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V

    • CDM ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V

  • Multiple package options

  • DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints

Parametrics

Type number VCC (V) Logic switching levels Power dissipation considerations Tamb (°C) Package name
74HCS237BQ-Q100 2.0 - 6.0 CMOS low -40~125 DHVQFN16
74HCS237D-Q100 2.0 - 6.0 CMOS low -40~125 SO16
74HCS237PW-Q100 2.0 - 6.0 CMOS low -40~125 TSSOP16

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
74HCS237BQ-Q100 74HCS237BQ-Q100X
(935692393115)		 Active S237 SOT763-1
DHVQFN16
(SOT763-1) 		SOT763-1 SOT763-1_115
74HCS237D-Q100 74HCS237D-Q100J
(935692475118)		 Active 74HCS237D SOT109-1
SO16
(SOT109-1) 		SOT109-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT109-1_118
74HCS237PW-Q100 74HCS237PW-Q100J
(935692391118)		 Active S237 SOT403-1
TSSOP16
(SOT403-1) 		SOT403-1 SSOP-TSSOP-VSO-WAVE
SOT403-1_118

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
74HCS237BQ-Q100 74HCS237BQ-Q100X 74HCS237BQ-Q100 rohs rhf rhf
74HCS237D-Q100 74HCS237D-Q100J 74HCS237D-Q100 rohs rhf rhf
74HCS237PW-Q100 74HCS237PW-Q100J 74HCS237PW-Q100 rohs rhf rhf
Quality and reliability disclaimer

Documentation (17)

File name Title Type Date
74HCS237_Q100 3-to-8 line decoder/demultiplexer with address latches, Schmitt-trigger inputs Data sheet 2025-10-24
AN90063 Questions about package outline drawings Application note 2025-10-22
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
74hcs237 74HCS237 IBIS model IBIS model 2025-10-26
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN16_SOT763-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body Marcom graphics 2017-01-28
SO16_SOT109-1_mk plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body Marcom graphics 2017-01-28
TSSOP16_SOT403-1_mk plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT763-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body Package information 2023-05-11
SOT109-1 plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT403-1 plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-08
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

Support

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Models

File name Title Type Date
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
74hcs237 74HCS237 IBIS model IBIS model 2025-10-26

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