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Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

74HCS367-Q100

Hex buffer/line driver with Schmitt-trigger inputs; 3-state

The 74HCS367-Q100 is a hex buffer/line driver with 3-state outputs controlled by the output enable inputs (nOE). A HIGH on nOE causes the outputs to assume a high impedance OFF-state. Inputs include clamp diodes. It enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.

All inputs are Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 2.0 V to 6.0 V

  • Schmitt-trigger inputs
  • Low power consumption
    • Typical supply current (ICC) of 100 nA
    • Typical input leakage current (II) of ±10 nA
  • ±7.8 mA output drive at 6 V
  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
  • Complies with JEDEC standards:
    • JESD7A (2.0 V to 6.0 V)

  • ESD protection:

    • HBM ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V

    • CDM ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V

  • Multiple package options

  • DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints

Parametrics

Type number VCC (V) Logic switching levels Power dissipation considerations Tamb (°C) Package name
74HCS367BQ-Q100 2.0 - 6.0 CMOS low -40~125 DHVQFN16
74HCS367D-Q100 2.0 - 6.0 CMOS low -40~125 SO16
74HCS367PW-Q100 2.0 - 6.0 CMOS low -40~125 TSSOP16

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
74HCS367BQ-Q100 74HCS367BQ-Q100X
(935692438115)		 Active S367 SOT763-1
DHVQFN16
(SOT763-1) 		SOT763-1 SOT763-1_115
74HCS367D-Q100 74HCS367D-Q100J
(935692484118)		 Active 74HCS367D SOT109-1
SO16
(SOT109-1) 		SOT109-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT109-1_118
74HCS367PW-Q100 74HCS367PW-Q100J
(935692436118)		 Active S367 SOT403-1
TSSOP16
(SOT403-1) 		SOT403-1 SSOP-TSSOP-VSO-WAVE
SOT403-1_118

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
74HCS367BQ-Q100 74HCS367BQ-Q100X 74HCS367BQ-Q100 rohs rhf rhf
74HCS367D-Q100 74HCS367D-Q100J 74HCS367D-Q100 rohs rhf rhf
74HCS367PW-Q100 74HCS367PW-Q100J 74HCS367PW-Q100 rohs rhf rhf
Quality and reliability disclaimer

Documentation (17)

File name Title Type Date
74HCS367_Q100 Hex buffer/line driver with Schmitt-trigger inputs; 3-state Data sheet 2025-10-30
AN90063 Questions about package outline drawings Application note 2025-10-22
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
74hcs367 74HCS367 IBIS model IBIS model 2025-10-31
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN16_SOT763-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body Marcom graphics 2017-01-28
SO16_SOT109-1_mk plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body Marcom graphics 2017-01-28
TSSOP16_SOT403-1_mk plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT763-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body Package information 2023-05-11
SOT109-1 plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT403-1 plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-08
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

Support

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Models

File name Title Type Date
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
74hcs367 74HCS367 IBIS model IBIS model 2025-10-31

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