AXP1T34

Dual supply translating buffer

The AXP1T34 is a single bit, dual supply translating buffer. It features one input (A), an output (Y) and dual supply pins (V_CCI and V_CCO). Both V_CCI and V_CCO can be supplied at any voltage between 0.9 V and 5.5 V making the device suitable for translating between any voltage nodes specified (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V and 5.0 V). No power supply sequencing is required and output glitches during power supply transitions are prevented using patented circuitry. As a result, glitches will not appear on the outputs for supply transitions during power-up/down between 20 mV/μs and 5.5 V/s

The input is referenced to V_CCI and the output is referenced to V_CCO. Schmitt-trigger action at the input makes the circuit tolerant of slower input rise and fall times.

This device ensures low static and dynamic power consumption across the entire supply range and is fully specified for partial power down applications using I_OFF. The I_OFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down. In suspend mode when either V_CCI or V_CCO are at GND level the output is in the high-impedance OFF-state

Features and benefits

Wide supply voltage range:
- V_CCI: 0.9 V to 5.5 V
- V_CCO: 0.9 V to 5.5 V
Low input capacitance; C_I = 1.5 pF (typical)
Low output capacitance; C_O = 3.8 pF (typical)
Low dynamic power consumption; C_PD = 0.4 pF at V_CCI = 1.2 V (typical)
Low dynamic power consumption; C_PD = 11 pF at V_CCO = 5 V (typical)
Low static power consumption; I_CCI = 0.1 µA (25 °C maximum)
Low static power consumption; I_CCO = 1.0 µA (25 °C maximum)
High noise immunity
Complies with JEDEC standard:
- JESD8-12 (1.1 V to 1.3 V; A input)
- JESD8-11 (1.4 V to 1.6 V)
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD8C (2.7 V to 3.6 V)
- JESD12-6 (4.5 V to 5.5 V)
ESD protection:
- HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Latch-up performance exceeds 100 mA per JESD78D Class II
Inputs accept voltages up to 5.5 V
Low noise overshoot and undershoot < 10% of V_CCO
I_OFF circuitry provides partial power-down mode operation
Multiple package options
Specified from −40 °C to +125 °C

Parametrics

Type number	Product status	Package name
AXP1T34GM	Production	XSON6
AXP1T34GS	Production	XSON6
AXP1T34GW	Production	TSSOP5
AXP1T34GX	Production	X2SON5

Package

Type number	Package	Package information	Reflow-/Wave soldering	Packing	Status	Marking	Orderable part number, (Ordering code (12NC))
AXP1T34GM	XSON6 (SOT886)	SOT886	REFLOW_BG-BD-1	SOT886_115	Active	r3	AXP1T34GMX ( 9356 916 27115 )
AXP1T34GS	XSON6 (SOT1202)	SOT1202	REFLOW_BG-BD-1	SOT1202_125	Active	r3	AXP1T34GSH ( 9356 916 26125 )
AXP1T34GW	TSSOP5 (SOT353-1)	SOT353-1	WAVE_BG-BD-1	SOT353-1_125	Active	r3	AXP1T34GWH ( 9356 916 24125 )
AXP1T34GX	X2SON5 (SOT1226-3)	SOT1226-3		SOT1226-3_125	Active	r3	AXP1T34GXH ( 9356 915 73125 )

Environmental information

Type number	Orderable part number	Chemical content
AXP1T34GM	AXP1T34GMX	AXP1T34GM
AXP1T34GS	AXP1T34GSH	AXP1T34GS
AXP1T34GW	AXP1T34GWH	AXP1T34GW
AXP1T34GX	AXP1T34GXH	AXP1T34GX

Quality and reliability disclaimer

Documentation (10)

File name	Title	Type	Date
AXP1T34	Dual supply translating buffer	Data sheet	2023-12-01
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
MAR_SOT1202	MAR_SOT1202 Topmark	Top marking	2013-06-03
SOT1202	plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body	Package information	2022-06-01
WAVE_BG-BD-1	Wave soldering profile	Wave soldering	2021-09-08
SOT353-1	plastic thin shrink small outline package; 5 leads; body width 1.25 mm	Package information	2022-11-15
MAR_SOT886	MAR_SOT886 Topmark	Top marking	2013-06-03
SOT886	plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Package information	2022-06-01
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
SOT1226-3	plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm	Package information	2020-08-27

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