74HCS137-Q100
3-to-8 line decoder/demultiplexer with address latches, Schmitt-trigger inputs and inverting output registers
The 74HCS137-Q100 decodes three binary weighted address inputs (A0, A1 and A2) to eight mutually exclusive outputs (Y0 to Y7). The device features a latch enable (LE) and two output enable (E1, E2) inputs. A LOW on LE causes the device to act as an active LOW decoder. A LOW-to HIGH transition on LE stores the data that was present before the transition in the latches. Further address changes are ignored as long as LE remains HIGH. The output enable inputs control the state of the outputs independently of the address inputs or latch operation. All outputs will be HIGH unless E1 is LOW and E2 is HIGH. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
All inputs are Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 V to 6.0 V
- Schmitt-trigger inputs
- Low power consumption
- Typical supply current (ICC) of 100 nA
- Typical input leakage current (II) of ±10 nA
- ±7.8 mA output drive at 6 V
Combines 3-to-8 decoder with 3-bit latch
Multiple input enable for easy expansion or independent controls
Active LOW mutually exclusive outputs
- Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Complies with JEDEC standards:
- JESD7A (2.0 V to 6.0 V)
ESD protection:
HBM ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V
CDM ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints
Parametrics
| Type number | VCC (V) | Logic switching levels | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|
| 74HCS137BQ-Q100 | 2.0 - 6.0 | CMOS | low | -40~125 | DHVQFN16 |
| 74HCS137D-Q100 | 2.0 - 6.0 | CMOS | low | -40~125 | SO16 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74HCS137BQ-Q100 | 74HCS137BQ-Q100X (935692383115) |
Active | S137 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74HCS137D-Q100 | 74HCS137D-Q100J (935692473118) |
Active | 74HCS137D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74HCS137BQ-Q100 | 74HCS137BQ-Q100X | 74HCS137BQ-Q100 |
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| 74HCS137D-Q100 | 74HCS137D-Q100J | 74HCS137D-Q100 |
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Documentation (13)
| File name | Title | Type | Date |
|---|---|---|---|
| 74HCS137_Q100 | 3-to-8 line decoder/demultiplexer with address latches, Schmitt-trigger inputs and inverting output registers | Data sheet | 2025-10-24 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| 74hcs137 | 74HCS137 IBIS model | IBIS model | 2025-10-26 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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