74HCS138-Q100
3-to-8 line decoder/demultiplexer with Schmitt-trigger inputs and inverting outputs
The 74HCS138-Q100 decodes three binary weighted address inputs (A0, A1 and A2) to eight mutually exclusive outputs (Y0 to Y7). The device features three enable inputs (E1, E2 and E3). Every output will be HIGH unless E1 and E2 are LOW and E3 is HIGH. This multiple enable function allows easy parallel expansion to a 1-of-32 (5 to 32 lines) decoder with just four ICs and one inverter. The 74HCS138 can be used as an eight output demultiplexer by using one of the active LOW enable inputs as the data input and the remaining enable inputs as strobes. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
All inputs are Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 V to 6.0 V
- Schmitt-trigger inputs
- Low power consumption
- Typical supply current (ICC) of 100 nA
- Typical input leakage current (II) of ±10 nA
- ±7.8 mA output drive at 6 V
Demultiplexing capability
Multiple input enable for easy expansion or independent controls
Ideal for memory chip select decoding
Active LOW mutually exclusive outputs
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Complies with JEDEC standards:
- JESD7A (2.0 V to 6.0 V)
ESD protection:
HBM ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V
CDM ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints
Parametrics
| Type number | VCC (V) | Logic switching levels | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|
| 74HCS138BQ-Q100 | 2.0 - 6.0 | CMOS | low | -40~125 | DHVQFN16 |
| 74HCS138D-Q100 | 2.0 - 6.0 | CMOS | low | -40~125 | SO16 |
| 74HCS138PW-Q100 | 2.0 - 6.0 | CMOS | low | -40~125 | TSSOP16 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74HCS138BQ-Q100 | 74HCS138BQ-Q100X (935692378115) |
Active | S138 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74HCS138D-Q100 | 74HCS138D-Q100J (935692472118) |
Active | 74HCS138D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HCS138PW-Q100 | 74HCS138PW-Q100J (935692376118) |
Active | S138 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74HCS138BQ-Q100 | 74HCS138BQ-Q100X | 74HCS138BQ-Q100 |
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| 74HCS138D-Q100 | 74HCS138D-Q100J | 74HCS138D-Q100 |
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| 74HCS138PW-Q100 | 74HCS138PW-Q100J | 74HCS138PW-Q100 |
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Documentation (17)
| File name | Title | Type | Date |
|---|---|---|---|
| 74HCS138_Q100 | 3-to-8 line decoder/demultiplexer with Schmitt-trigger inputs and inverting outputs | Data sheet | 2025-10-24 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| 74hcs138 | 74HCS138 IBIS model | IBIS model | 2025-10-26 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| 74hcs138 | 74HCS138 IBIS model | IBIS model | 2025-10-26 |
Ordering, pricing & availability
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