Nexperia announces smallest logic package that can be used without a step-down mask

August 27, 2018

Nijmegen -- Miniature 4-pin ≥0.4mm-pitch devices reduce assembly costs and increase reliability

Nexperia, the global leader in discretes, logic and MOSFET devices, today announced the four pin X2SON4 package which is the smallest logic package that can be used without requiring an expensive and fragile step-down mask. Therefore, PCB assembly is quicker, easier, more reliable and more cost-effective.

Nexperia developed the X2SON packages - part of its MicroPak package range - to provide the smallest footprint for logic functions while ensuring pad pitch remains 0.4mm or over (step-down masks are only needed under that threshold). The company’s low-power AUP, AXP, LV and LVC technology families covering over one hundred logic solutions are now available in X2SON 8, 6, 5 and 4-pin packages.

The new 4-pin X2SON4 package option reduces the footprint of the same function by 44% when compared to 5-pin X2SON5, and by up to 64% when compared to XSON packages.

Michael Lyons, senior product manager at Nexperia commented: “X2SON4 enables the release of smaller buffers and inverters, that were previously only available in 5-pin or 6-pin leadless packages. All our X2SON solutions enable miniaturization without the use of expensive and fragile step down masks.”

As packages become smaller, the pad pitch is reduced – making the use of standard assembly tools difficult. If the pitch is reduced to less than 0.4mm, thinner and delicate step down masks (stencils) are required to apply solder paste. They typically need to be replaced regularly, may also require a different, more expensive solder paste, and the placement of components may be restricted because the mask won’t work over the entire board.

X2SON packages from Nexperia require no step-down mask, thus saving manufacturing costs. In addition, the X2SON’s larger pad pitch provides greater contact area, resulting in easier component placement, as well as improved joint strength and robustness. Larger pad pitches make it easier to avoid costly assembly problems such as misaligned components, and reduce the risk of short circuits. 

The new future-proof X2SON4 logic package also features a low 0.32mm profile and low 0.6mm width and length, suiting space-constrained, portable applications such as IoT, wearables and consumer electronics. Devices are RoHS & dark-green compliant with NiPdAu leadframe finish. Ten AUP and LVC logic buffers / inverters are currently available from Nexperia in the new X2SON4 (SOT1269-2) package. For more information on Nexperia’s portfolio in X2SON packages click here or download the leaflet here. Get datasheets here from the “Products” tab.

About Nexperia

Nexperia, the former Standard Products division of NXP, is a dedicated global leader in Discretes, Logic and MOSFET devices. The company became independent at the beginning of 2017. Focused on efficiency, Nexperia produces consistently reliable semiconductor components at high volume: 90 billion annually. Our extensive portfolio meets the stringent standards set by the Automotive industry. Industry-leading, miniature packages, produced in our own manufacturing facilities, combine power and thermal efficiency with best-in-class quality levels.
With over 50 years history supplying to the world’s biggest companies, Nexperia has over 11,000 employees across Asia, Europe and the U.S., offering global support. The company has an extensive IP portfolio and is certified to ISO9001, ISO/TS16949, ISO14001 and OHSAS18001.

Nexperia: Efficiency wins.

For press information, please contact:

Nexperia Agency: BWW Communications

Petra Beekmans, Head of Communications & Branding
Phone: +31 6 137 111 41
Email: petra.beekmans@nexperia.com

Nick Foot, director
+44-1491-636393
Nick.foot@bwwcomms.com