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MOSFETs

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Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

74HCS74

Dual D-type flip-flop with Schmitt-trigger inputs; set and reset; positive edge-trigger

The 74HCS74 is a dual positive edge triggered D-type flip-flop. They have individual data (nD), clock (nCP), set (nSD) and reset (nRD) inputs, and complementary nQ and nQ outputs. Data at the nD-input, that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition, is stored in the flip-flop and appears at the nQ output. Inputs include clamp diodes that enable the use of current limiting resistors to interface inputs to voltages in excess of VCC.

All inputs are Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.

Features and benefits

  • Wide supply voltage range from 2.0 V to 6.0 V

  • Schmitt-trigger inputs
  • Low power consumption
    • Typical supply current (ICC) of 100 nA
    • Typical input leakage current (II) of ±10 nA
  • ±7.8 mA output drive at 6 V
  • Symmetrical output impedance

  • Balanced propagation delays

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
  • Complies with JEDEC standards:
    • JESD7A (2.0 V to 6.0 V)
  • ESD protection:

    • HBM ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V

    • CDM ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

Parametrics

Type number VCC (V) Logic switching levels Power dissipation considerations Tamb (°C) Package name
74HCS74BQ 2.0 - 6.0 CMOS low -40~125 DHVQFN14
74HCS74D 2.0 - 6.0 CMOS low -40~125 SO14
74HCS74PW 2.0 - 6.0 CMOS low -40~125 TSSOP14

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
74HCS74BQ 74HCS74BQX
(935692296115)
Active HCS74 SOT762-1
DHVQFN14
(SOT762-1)
SOT762-1 SOT762-1_115
74HCS74D 74HCS74DJ
(935692297118)
Active 74HCS74D SOT108-1
SO14
(SOT108-1)
SOT108-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT108-1_118
74HCS74PW 74HCS74PWJ
(935692295118)
Active HCS74 SOT402-1
TSSOP14
(SOT402-1)
SOT402-1 SSOP-TSSOP-VSO-WAVE
SOT402-1_118

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
74HCS74BQ 74HCS74BQX 74HCS74BQ rohs rhf rhf
74HCS74D 74HCS74DJ 74HCS74D rohs rhf rhf
74HCS74PW 74HCS74PWJ 74HCS74PW rohs rhf rhf
Quality and reliability disclaimer

Documentation (17)

File name Title Type Date
74HCS74 Dual D-type flip-flop with Schmitt-trigger inputs; set and reset; positive edge-trigger Data sheet 2025-07-07
AN90063 Questions about package outline drawings Application note 2025-06-13
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT108-1 3D model for products with SOT108-1 package Design support 2020-01-22
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
74hcs74 74HCS74 IBIS Model IBIS model 2025-07-01
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN14_SOT762-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body Marcom graphics 2017-01-28
SO14_SOT108-1_mk plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body Marcom graphics 2017-01-28
TSSOP14_SOT402-1_mk plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT762-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body Package information 2023-04-05
SOT108-1 plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT402-1 plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-07
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

Support

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Models

File name Title Type Date
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT108-1 3D model for products with SOT108-1 package Design support 2020-01-22
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
74hcs74 74HCS74 IBIS Model IBIS model 2025-07-01

Ordering, pricing & availability

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